IC manufacturers Texas Instruments

IC manufacturers (103)

Texas Instruments TPD4E05U06DQAR | Demoboard TIDA-010057

Ultrasound smart probe power supply reference design

Overview

TopologyOther Topology
IC revisionE2

Description

Significant technological advancements and high degree of integration in Medical imaging, especially hand-held ultrasound smart probes, are pushing engineers to come up with highly-efficient, noise immune power solutions in a small size. This reference design documents end to end power and data solution for our high performance 128-channel Tx/64-channel Rx ultrasound smart probe solution with TX7332 transmit chip and AFE5832LP receive chip. The power tree includes a single-stage transformer-less HV generation (up to +/- 80V & height <5mm) for transmit and the point-of-load LV for the AFEs & FPGA from a 5V USB Type-C™ input. This design enables low-noise (<10mV ripple) efficient rails and better thermal performance (< 10°C temp rise) achieving system efficiency ~80%, receive data SNR > 55dB and ultra-compact size (90mm x 45mm x 20mm). All power rails can be synchronized to an external clock using our integrated buffer-divider CDCE949. This design also supports 1S battery input with a normal ultrasound operation of up to 2 hours.

Features

  • Transformer less dual rail HV (±80V @ 25 mA) generation from 5V USB in single stage implementation to meet component height requirement of < 5mm
  • Low ripple and LV supply for the front end and FPGA from a 5V USB Type-C input
  • Compact board size (< 90mm x 45 mm x 20mm)
  • End to End System Efficiency ~80% running at full load
  • SNR > 55dB (Noise Floor below -90dB)
  • EN/DISABLE supplies for power optimization and all rails can be synchronized to external clock
  • Accurate real time power consumption measurement using high performance instrumentation amplifiers INA231
  • High speed data acquisition over USB Type C up to 4.2 Gbps

Typical applications

  • Ultrasound smart probe

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
Interface Type
Gender
Pins
Mount
PCB Thickness(mm)
IR(A)
Working Voltage(V (DC))
Packaging
Z @ 100 MHz(Ω)
Zmax(Ω)
Test Condition Zmax
IR 2(mA)
RDC max.(Ω)
Type
Samples
WR-USB Type C Connectors, USB 3.1, Type C
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Interface TypeType C 
GenderReceptacle 
Pins24 
MountTHR 
PCB Thickness1.6 mm
Rated Current5 A
Working Voltage48 V (DC)
PackagingTape and Reel 
TypeHorizontal 
WE-CBF SMT EMI Suppression Ferrite Bead, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
MountSMT 
Rated Current2 A
Impedance @ 100 MHz30 Ω
Maximum Impedance40 Ω
Maximum Impedance1000 MHz 
Rated Current 23000 mA
DC Resistance0.04 Ω
TypeHigh Current