IC manufacturers Texas Instruments

IC manufacturers (103)

Texas Instruments LMX1214 | Demoboard LMX1214EVM

LMX1214 Evaluation Module

Overview

TopologyRF signals / communications
IC revisionA

Description

The LMX1214 evaluation module (EVM) is designed to evaluate the performance of the LMX1214 which is a four-output, ultra-low additive jitter radio-frequency (RF) buffer & divider. The device can buffer RF frequencies up to 16GHz and divide outputs by up to 6.4GHz. This board consists of an LMX1214 device and an integrated USB2ANY programmer

Features

300MHz to 16GHz output frequency

  • 4 high-frequency clocks– Shared divide by 2, 3, 4, 5, 6, 7 and 8
  • 2.5V operating voltage
  • –40ºC to +85ºC operating temperature
  • Optional pin mode control without registerprogramming

Typical applications

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
C
Tol. C
VR(V (DC))
Size
Operating Temperature
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
Z @ 100 MHz(Ω)
Zmax(Ω)
Test Condition Zmax
IR 2(mA)
RDC max.(Ω)
Type
Samples
WCAP-CSGP MLCCs 16 V(DC), 2.2 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 50 V(DC), 3.3 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance3.3 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 16 V(DC), 100 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 16 V(DC), 1 µF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.1 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 16 V(DC), 2.2 µF, ±20%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 µF
Capacitance±20% 
Rated Voltage16 V (DC)
Size0603 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor10 %
Insulation Resistance0.05 GΩ
Ceramic TypeX5R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WE-CBF SMT EMI Suppression Ferrite Bead, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size0603 
Operating Temperature -55 °C up to +125 °C
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.3 mm
Impedance @ 100 MHz120 Ω
Maximum Impedance180 Ω
Maximum Impedance400 MHz 
Rated Current 22000 mA
DC Resistance0.05 Ω
TypeHigh Current