IC manufacturers Texas Instruments

IC manufacturers (103)

Texas Instruments LM5181 | Demoboard PMP31177

1-W primary-side regulated flyback reference design

Overview

TopologyFlyback Converter
Input voltage18-32 V
Switching frequency12-350 kHz
Output 124 V
IC revisionB

Description

This 26.54 mm × 11.68 mm × 5.6-mm height board is optimized to leverage the performance of the LM5181 PSR Flyback converter. The board operates over an input voltage range of 18 V to 32 V to deliver a 24-V and 3.3-V outputs at currents up to 40 mA and 15 mA, respectively. Operating without an auxiliary winding or optocoupler, the LM5181 provides very tight output voltage regulation. The LM5181 offers several protection features, like undervoltage lockout to provide proper operation during voltagesag conditions, programmable soft-start to reduce inrush current, hiccup-mode overcurrent protection, and thermal shutdown.

Features

  • 18-V to 32-V input voltage range
  • 24-V and 3.3-V output voltages
  • Up to 1-W total output power
  • High-voltage isolation
  • Fully assembled and tested PCB layout with small footprint and low profile

Typical applications

  • Sub-AM band automotive body electronics, Automotive HEV/EV powertrain systems
  • Isolated bias supplies
  • Traction inverters: IGBT and SiC gate drivers

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
C
Tol. C
VR(V (DC))
Size
Operating Temperature
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
Fl(mm)
Packaging
Z @ 100 MHz(Ω)
Zmax(Ω)
Test Condition Zmax
IR(mA)
Z @ 1 GHz(Ω)
H(mm)
Type
Samples
WCAP-CSGP MLCCs 25 V(DC), 47 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance47 nF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Height0.8 mm
WCAP-CSGP MLCCs 100 V(DC), 100 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage100 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Insulation Resistance1 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Height0.8 mm
WCAP-CSGP MLCCs 25 V(DC), 1 µF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), 4.7 µF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance4.7 µF
Capacitance±10% 
Rated Voltage50 V (DC)
Size1206 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.02 GΩ
Ceramic TypeX7R Class II 
Length3.2 mm
Width1.6 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Height1.6 mm
WCAP-CSGP MLCCs 10 V(DC), 22 µF, ±20%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance22 µF
Capacitance±20% 
Rated Voltage10 V (DC)
Size0805 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor10 %
Insulation Resistance0.005 GΩ
Ceramic TypeX5R Class II 
Length2 mm
Width1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
Height1.25 mm
WE-MPSB EMI Multilayer Power Suppression Bead, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size0805 
Operating Temperature -55 °C up to +125 °C
Length2 mm
Width1.2 mm
Pad Dimension0.5 mm
Impedance @ 100 MHz600 Ω
Maximum Impedance551 Ω
Maximum Impedance108 MHz 
Rated Current2100 mA
Impedance @ 1 GHz103 Ω
Height0.9 mm
TypeHigh Current