| Topology | FPGA |
| IC revision | C |
F29H85X-SOM-EVM is an evaluation and development board for TI C2000™ MCU series of F29H85x and F29P58x devices. This system-on-module design is ideal for initial evaluation and prototyping. For evaluation of F29H85X-SOM-EVM, the XDS110ISO-EVM debug probe is required and can be purchased separately.
eaturesHardware:
Three standard 120-pin controlSOM high-density connectorsPower management IC for safety applicationsAnalog I/O, digital I/O and JTAG signals at board interfaceSoftware:
Free download of Code Composer Studio IDEFree download of F29X-SDK for device drivers and example projectsMotorControl SDKDigitalPower SDK
Order Code | Datasheet | Simulation | Downloads | Status | Product series | C | Tol. C | VR(V (DC)) | Size | Operating Temperature | Q(%) | RISO | Ceramic Type | L(mm) | W(mm) | H(mm) | Fl(mm) | Packaging | Z @ 100 MHz(Ω) | Zmax(Ω) | Test Condition Zmax | IR 2(mA) | RDC max.(Ω) | Type | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WCAP-CSGP MLCCs 50 V(DC), 330 pF, ±5% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 50 V(DC) | Capacitance330 pF | Capacitance±5% | Rated Voltage50 V (DC) | Size0603 | Operating Temperature -55 °C up to +125 °C | Q-Factor1000 % | Insulation Resistance10 GΩ | Ceramic TypeNP0 Class I | Length1.6 mm | Width0.8 mm | Height0.8 mm | Pad Dimension0.4 mm | Packaging7" Tape & Reel | – | – | – | – | – | – | |||||
![]() | WE-CBF SMT EMI Suppression Ferrite Bead, –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWE-CBF SMT EMI Suppression Ferrite Bead | – | – | – | Size0603 | Operating Temperature -55 °C up to +125 °C | – | – | – | Length1.6 mm | Width0.8 mm | Height0.8 mm | Pad Dimension0.3 mm | – | Impedance @ 100 MHz60 Ω | Maximum Impedance110 Ω | Maximum Impedance600 MHz | Rated Current 23000 mA | DC Resistance0.04 Ω | TypeHigh Current |