IC manufacturers Texas Instruments

IC manufacturers (103)

Texas Instruments DRV8306 | Demoboard DRV8306EVM

40-V max, sensored trapezoidal control, 3-phase BLDC smart gate driver

Overview

TopologyOther Topology
Input voltage6-38 V
IC revisionE1

Description

The DRV8306 device is an integrated gate driver for 3-phase brushless DC (BLDC) motor applications. The device provides three half-bridge gate drivers, each capable of driving high-side and low-side N-channel power MOSFETs. The DRV8306 device generates the proper gate drive voltages using an integrated charge pump for the high-side MOSFETs and a linear regulator for the low-side MOSFETs. The smart gate drive architecture supports up to 150-mA source and 300-mA sink peak gate drive current and 15-mA rms gate drive current capability.The device provides an internal 120° commutation for the trapezoidal BLDC motor. The DRV8306 device has three Hall comparators which use the input from the Hall elements for internal commutation. The duty cycle ratio of the phase voltage of the motor can be adjusted through the PWM pin. Additional brake (nBRAKE) and direction (DIR) pins are provided for braking and setting the direction of the BLDC motor. A 3.3-V, 30-mA low-dropout (LDO) regulator is provided to supply the external controller and Hall elements. An additional FGOUT signal is provided which is a measure of the commutation frequency. This signal can be used for implementing the closed-loop control of BLDC motor.A low-power sleep mode is provided to achieve low quiescent current draw by shutting down most of the internal circuitry. Internal protection functions are provided for undervoltage lockout, charge pump fault, MOSFET overcurrent, MOSFET short circuit, gate driver fault, and overtemperature. Fault conditions are indicated on the nFAULT pin.

Features

  • 6-V to 38-V, Triple Half-Bridge Gate Driver With Integrated 3x Hall Comparators
  • 40-V Absolute Maximum Rating
  • Fully Optimized for 12-V and 24-V DC Rails
  • Drives High-Side and Low-Side N-Channel MOSFETs
  • Supports 100% PWM Duty Cycle
  • Smart Gate Drive Architecture
  • Adjustable Slew-Rate Control for Better EMI and EMC Performance
  • VGS Hand-Shake and Minimum Dead-Time Insertion to Avoid Shoot-Through
  • 15-mA to 150-mA Peak Source Current
  • 30-mA to 300-mA Peak Sink Current
  • Integrated Commutation from Hall Sensors
  • 120° Trapezoidal Current Control
  • Supports Low-Cost Hall Elements
  • Tacho Output Signal (FGOUT) for Closed Loop Speed Control
  • Integrated Gate Driver Power Supplies
  • High-Side Charge Pump
  • Low-Side Linear Regulator
  • Cycle-by-Cycle Current Limit
  • Supports 1.8-V, 3.3-V, and 5-V Logic Inputs
  • Low-Power Sleep Mode
  • Linear Voltage Regulator, 3.3 V, 30 mA
  • Compact VQFN Package and Footprint
  • Integrated Protection Features
  • VM Undervoltage Lockout (UVLO)
  • Charge Pump Undervoltage (CPUV)
  • MOSFET Overcurrent Protection (OCP)
  • Gate Driver Fault (GDF)
  • Thermal Shutdown (OTSD)
  • Fault Condition Indicator (nFAULT)

Typical applications

  • BLDC Motor Modules
  • Service Robots and Service Robotics / Vacuum Cleaners / Drones, Robotics, and RC Toys / White Goods / ATM and Currency Counting

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
Pins
PCB/Cable/Panel
Modularity
Type
Wire Section
C
Tol. C
VR(V (DC))
Size
Operating Temperature
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
Samples
WR-TBL Series 101 - 5.00 mm Horizontal Entry Modular, 2, Wire Protector
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pins
PCB/Cable/PanelPCB 
ModularityYes 
TypeHorizontal 
Wire Section 26 to 14 (AWG) 0.5 to 2.5 (mm²)
Operating Temperature -40 °C up to +105 °C
Length10 mm
Height12.6 mm
PackagingBox 
WR-TBL Series 101 - 5.00 mm Horizontal Entry Modular, 3, Wire Protector
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Pins
PCB/Cable/PanelPCB 
ModularityYes 
TypeHorizontal 
Wire Section 26 to 14 (AWG) 0.5 to 2.5 (mm²)
Operating Temperature -40 °C up to +105 °C
Length15 mm
Height12.6 mm
PackagingBox 
WCAP-CSGP MLCCs 10 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage10 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.1 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel