| Topology | Other Topology |
| IC revision | E1 |
This reference design is built keeping an electronic imaging system in mind. Image sensors today force heavy demands on ADCs in terms of: excellent linearity (DNL < 0.5 LSB and INL < 4 LSB), high resolution (12- to 18-bit), high speed (up to 20 MSPS), and high SNR (> 74-dB SNR) to assure superior image quality and freedom from distortion over time. Enabled by the low-noise, high-speed amplifier, fully differential amplifier (FDA), high-speed ADC, and low-noise LDO from TI, this reference design demonstrates how to design a high-performance analog signal chain for digitizing the pixel-output signal in thermal imaging cameras.
Order Code | Datasheet | Simulation | Downloads | Status | Product series | C | Tol. C | VR(V (DC)) | Size | Operating Temperature | Q(%) | RISO | Ceramic Type | L(mm) | W(mm) | H(mm) | Fl(mm) | Packaging | Samples |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WCAP-CSGP MLCCs 25 V(DC), 33 pF, ±5% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 25 V(DC) | Capacitance33 pF | Capacitance±5% | Rated Voltage25 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Q-Factor1000 % | Insulation Resistance10 GΩ | Ceramic TypeNP0 Class I | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel |