| Topologie | Sonstige Topologie |
| IC-Revision | E1 |
This reference design is built keeping an electronic imaging system in mind. Image sensors today force heavy demands on ADCs in terms of: excellent linearity (DNL < 0.5 LSB and INL < 4 LSB), high resolution (12- to 18-bit), high speed (up to 20 MSPS), and high SNR (> 74-dB SNR) to assure superior image quality and freedom from distortion over time. Enabled by the low-noise, high-speed amplifier, fully differential amplifier (FDA), high-speed ADC, and low-noise LDO from TI, this reference design demonstrates how to design a high-performance analog signal chain for digitizing the pixel-output signal in thermal imaging cameras.
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR(V (DC)) | Bauform | Betriebstemperatur | Q(%) | RISO | Keramiktyp | L(mm) | B(mm) | H(mm) | Fl(mm) | Verpackung | Muster |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WCAP-CSGP MLCCs 25 V(DC), 33 pF, ±5% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 25 V(DC) | Kapazität33 pF | Kapazität±5% | Nennspannung25 V (DC) | Bauform0402 | Betriebstemperatur -55 °C up to +125 °C | Güte1000 % | Isolationswiderstand10 GΩ | KeramiktypNP0 Klasse I | Länge1 mm | Breite0.5 mm | Höhe0.5 mm | Pad Dimension0.25 mm | Verpackung7" Tape & Reel |