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STMicroelectronics STWLC38 | Demoboard STDES-WLC38WA
Qi-compatible wireless power receiver reference design for Qi 2.5 W applications
Overview
| Topology | Wireless Power Transfer |
| IC revision | 1 |
Description
The STDES-WLC38WA reference design is based on STWLC38. It is designed for wireless power receiver applications and it allows you to quickly start your 2.5 W Qi-BPP compatible wireless charging receiver projects.This reference design document provides sufficient information to develop a project for up to 2.5 W charging using baseline power profile (BPP).Through the I²C interface you can access and modify different configuration parameters, tailoring the operation of the device to the needs of custom applications. Using an on-board USB-to-I²C bridge, the user can monitor and control the STWLC38 using the STSW-WPSTUDIO graphical user interface (GUI).
Features
- Up to 15 W output power
- Up to 5W output power in Tx mode
- Qi 1.3 inductive wireless standard communication protocol compliant
- High efficiency (98% typical) synchronous rectifier operating up to 800 kHz
- Low drop-out linear regulator with output current limit and input voltage control loop
- Adaptive Rectifier Configuration (ARC) Mode for enhanced spatial freedom
- 4 V to 12 V programmable output voltage
- Above 85% overall system efficiency
- 32-bit, 64 MHz ARM Cortex M0+ core with 32kB RRAM,16 kB SRAM,64kB ROM
- 10-bit A/D Converter
- Configurable GPIOs
- I2C Slave interface
- Multi-level ASK modulator, Enhanced FSK demodulator
- Output Over-Voltage clamping protection
- Accurate voltage/current measurement for Foreign Object Detection (FOD)
- On-chip thermal management and protections
- Flip chip 40 bumps (2.12mm x 3.32mm)
Typical applications
- Smartphones
- Wearable/Hearables TWS
- Medical and healthcare equipment
More information
Products
Order Code | Datasheet | Simulation | Downloads | Status | Product series | C | Tol. C | VR(V (DC)) | Size | Operating Temperature | DF(%) | RISO | Ceramic Type | L(mm) | W(mm) | H(mm) | Fl(mm) | Packaging | Samples |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WCAP-CSGP MLCCs 25 V(DC), 1 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 25 V(DC) | Capacitance1 nF | Capacitance±10% | Rated Voltage25 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Dissipation Factor3.5 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | ||||
| WCAP-CSGP MLCCs 25 V(DC), 10 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 25 V(DC) | Capacitance10 nF | Capacitance±10% | Rated Voltage25 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Dissipation Factor3.5 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | ||||
| WCAP-CSGP MLCCs 25 V(DC), 22 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 25 V(DC) | Capacitance22 nF | Capacitance±10% | Rated Voltage25 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Dissipation Factor3.5 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | ||||
| WCAP-CSGP MLCCs 25 V(DC), 47 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 25 V(DC) | Capacitance47 nF | Capacitance±10% | Rated Voltage25 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Dissipation Factor3.5 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | ||||
| WCAP-CSGP MLCCs 25 V(DC), 100 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 25 V(DC) | Capacitance100 nF | Capacitance±10% | Rated Voltage25 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Dissipation Factor10 % | Insulation Resistance5 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging13" Tape & Reel | ||||
| WCAP-CSGP MLCCs 6.3 V(DC), 1 µF, ±20% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 6.3 V(DC) | Capacitance1 µF | Capacitance±20% | Rated Voltage6.3 V (DC) | Size0402 | Operating Temperature -55 °C up to +85 °C | Dissipation Factor15 % | Insulation Resistance0.1 GΩ | Ceramic TypeX5R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | ||||
| WCAP-CSGP MLCCs 6.3 V(DC), 4.7 µF, ±20% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 6.3 V(DC) | Capacitance4.7 µF | Capacitance±20% | Rated Voltage6.3 V (DC) | Size0402 | Operating Temperature -55 °C up to +85 °C | Dissipation Factor20 % | Insulation Resistance0.01 GΩ | Ceramic TypeX5R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel |