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Overview
| Topology | USB |
| Input voltage | 5 V |
| IC revision | A01 |
Description
The EFR32xG24 Dev Kit is a compact, feature-packed development platform. It provides the fastest path to develop and prototype wireless IoT products. The development platform supports up to +10 dBm output power and includes support for the 20-bit ADC as well as other key features. With the xG24’s AI/ML hardware accelerator, this is the ideal development board for AI/ML development including platforms from TinyML, Edge Impulse, SensiML and MicroAI.
Features
- 2.4 GHz ceramic chip antenna
- Power control of on-board peripherals forultra-low power operation
- Relative humidity and temperature sensor
- Ambient light sensor
- Hall effect sensor
- 6-axis inertial sensor
- MEMS stereo microphones
- Pressure sensor
- 32 Mbit flash for OTA programming anddata logging
- RGB LED and two push buttons
- Precise voltage reference and dedicatedU.FL connector for ADC measurements
- 20-pin 2.54 mm breakout pads
- Qwiic® connector
- SEGGER J-Link on-board debugger
- Virtual COM port
- Packet Trace Interface (PTI)
- Mini Simplicity connector for AEM andpacket trace using external Silicon Labsdebugger
- USB or coin cell battery powered
- External battery connector
Typical applications
- Tire Monitoring Sensor (TMS)
- Garage Door Openers
- Remote Controls
- Rearview Mirrors
- Building Automation - Gateways, sensors, switches, location services
- Smart Home - Gateways and hubs, sensors, switches, door locks, smart plugs
- Passive Keyless Entry (PKE)
- Lighting - LED bulbs, luminaires
- AI/ML - Predictive maintenance, glass break detection, wake-word detection
- Tire Pressure Monitoring System (TPMS)
- Passive Entry Passive Start (PEPS)
More information
Products
Order Code | Datasheet | Simulation | Downloads | Status | Product series | IR(mA) | RDC(Ω) | Z @ 100 MHz(Ω) | Zmax(Ω) | Test Condition Zmax | IR 2(mA) | Test Condition IR 2 | Z @ 1 GHz(Ω) | Type | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | WE-TMSB Tiny Multilayer Suppression Bead, 200 mA, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWE-TMSB Tiny Multilayer Suppression Bead | Rated Current200 mA | – | Impedance @ 100 MHz240 Ω | Maximum Impedance460 Ω | Maximum Impedance536 MHz | Rated Current 2300 mA | Rated Current 2ΔT = 40 K | Impedance @ 1 GHz342 Ω | TypeWide Band | ||||
 | WE-CBA SMT EMI Suppression Ferrite Bead, 400 mA, 0.3 Ω | Downloads10 files | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWE-CBA SMT EMI Suppression Ferrite Bead | Rated Current400 mA | DC Resistance0.3 Ω | Impedance @ 100 MHz220 Ω | Maximum Impedance330 Ω | Maximum Impedance400 MHz | – | – | Impedance @ 1 GHz262.58 Ω | TypeWide Band |