| Topology | Other Topology |
| Input voltage | 5 V |
| IC revision | A00 |
ZGM230-DK2603A is a Z-Wave ZGM230S SiP module-based development kit. It is a feature-rich, cost-effective, small form factor prototype and development platform for Z-Wave. It is an ideal platform for developing energy-friendly and secure connected IoT devices using Z-Wave mesh and Z-Wave Long Range. It ships with Unify SDK Z-Wave protocol controller that works with any Z-Wave end devices. Customers can develop wide range command, control, and monitoring applications utilizing numerous sensors, buttons, and LEDs on this board. A built in SEGGER J-Link debugger ensures easy debugging through the USB Type-C connector.
Order Code | Datasheet | Simulation | Downloads | Status | Product series | Z @ 100 MHz(Ω) | Zmax(Ω) | Test Condition Zmax | IR 2(mA) | Test Condition IR 2 | Z @ 1 GHz(Ω) | Type | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | WE-TMSB Tiny Multilayer Suppression Bead, 240 Ω, 460 Ω | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWE-TMSB Tiny Multilayer Suppression Bead | Impedance @ 100 MHz240 Ω | Maximum Impedance460 Ω | Maximum Impedance536 MHz | Rated Current 2300 mA | Rated Current 2ΔT = 40 K | Impedance @ 1 GHz342 Ω | TypeWide Band |