| Topologie | Sonstige Topologie |
| Eingangsspannung | 5 V |
| IC-Revision | A00 |
ZGM230-DK2603A is a Z-Wave ZGM230S SiP module-based development kit. It is a feature-rich, cost-effective, small form factor prototype and development platform for Z-Wave. It is an ideal platform for developing energy-friendly and secure connected IoT devices using Z-Wave mesh and Z-Wave Long Range. It ships with Unify SDK Z-Wave protocol controller that works with any Z-Wave end devices. Customers can develop wide range command, control, and monitoring applications utilizing numerous sensors, buttons, and LEDs on this board. A built in SEGGER J-Link debugger ensures easy debugging through the USB Type-C connector.
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Z @ 100 MHz(Ω) | Zmax(Ω) | Testbedingung Zmax | IR 2(mA) | Testbedingung IR 2 | Z @ 1 GHz(Ω) | Typ | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | WE-TMSB SMT-Ferrit, 240 Ω, 460 Ω | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWE-TMSB SMT-Ferrit | Impedanz @ 100 MHz240 Ω | Maximale Impedanz460 Ω | Maximale Impedanz536 MHz | Nennstrom 2300 mA | Nennstrom 2ΔT = 40 K | Impedanz @ 1 GHz342 Ω | TypBreitband |