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Renesas RZ/V2MA
Vision AI MPU With Renesas DRP-AI High-efficiency AI Accelerator and OpenCV Image Processing Accelerator Enabling Real-time Object Recognition
Overview
| Topology | Other Topology |
| IC revision | 1.00 |
Description
This product is an evaluation kit equipped with Renesas Electronics MPU (RZ/V2MA). RZ/V2MA has a power-efficient AI accelerator (DRP-AI) and an OpenCV accelerator for AI pre- and post-processing. The evaluation kit is equipped with a microSD card slot, LPDDR4, eMMC, USB host peripherals, GigabitEthernet, etc., enabling the development of various embedded AIs that require image streaming through these interfaces. It is an open price.
Features
- Vision and Artificial Intelligence
- AI Accelerator; DRP-AI at 1.0 TOPS/W class
- OpenCV Accelerator (DRP)
- High Speed Interfaces
- 1x Gigabit Ethernet
- 1x USB3.1 Gen1 Host/Peripheral
- 1x PCIe Gen 2 (2-lane)
- 2x SDIO 3.0
- 1x eMMC 4.5.1
- CPU and DDR Memory Interfaces
- 2x Cortex-A53 up to 1.0GHz
- 32-bit LPDDR4-3200
- Video and Graphics, Display
- H.265/H.264 Multi Codec
- Encoding; h.265 up to 2160p, h.264 up to 1080p
- Decoding; h.265 up to 2160p, h.264 up to 1080p
- Package: FCBGA, 15x15mm 0.5mm pitch
Typical applications
- AI Accelerator: DRP-AI
More information
Products
| Order Code | Datasheet | Simulation | Downloads | Status | Product series | λDom typ. (nm) | Emitting Color | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chip Technology | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Size | Operating Temperature | DF (%) | RISO | Ceramic Type | L (mm) | W (mm) | H (mm) | Fl (mm) | Packaging | Z @ 100 MHz (Ω) | Zmax (Ω) | Test Condition Zmax | IR 2 (mA) | RDC max. (Ω) | Type | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 150040GS73240 | SPEC | 7 files | Active i| Production is active. Expected lifetime: >10 years. | WL-SMCC SMT Mono-color Chip LED Compact | 525 | Green | 515 | 800 | 3.2 | InGaN | 120 | – | – | – | 0402 | -40 °C up to +85 °C | – | – | – | 1 | 0.5 | 0.4 | – | Tape and Reel | – | – | – | – | – | – | ||
 | 7427927310 | SPEC | 8 files | Active i| Production is active. Expected lifetime: >10 years. | WE-CBF SMT EMI Suppression Ferrite Bead | – | – | – | – | – | – | – | – | – | – | 0402 | -55 °C up to +125 °C | – | – | – | 1 | 0.5 | 0.5 | 0.25 | – | 10 | 15 | 800 MHz | 2000 | 0.03 | High Current | ||
 | 885012205061 | SPEC | 9 files | Active i| Production is active. Expected lifetime: >10 years. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 1 nF | ±10% | 50 | 0402 | -55 °C up to +125 °C | 2.5 | 10 GΩ | X7R Class II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | ||
| 885012105007 | SPEC | 7 files | Active i| Production is active. Expected lifetime: >10 years. | WCAP-CSGP MLCCs 6.3 V(DC) | – | – | – | – | – | – | – | 2.2 µF | ±20% | 6.3 | 0402 | -55 °C up to +85 °C | 20 | 0.02 GΩ | X5R Class II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – |
| Order Code | Datasheet | Simulation | |
|---|---|---|---|
| 150040GS73240 | SPEC | |
| 7427927310 | SPEC | |
| 885012205061 | SPEC | |
| 885012105007 | SPEC |
| Samples |
|---|
| Order Code | Datasheet | Simulation | Downloads | Status | Product series | λDom typ. (nm) | Emitting Color | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chip Technology | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Size | Operating Temperature | DF (%) | RISO | Ceramic Type | L (mm) | W (mm) | H (mm) | Fl (mm) | Packaging | Z @ 100 MHz (Ω) | Zmax (Ω) | Test Condition Zmax | IR 2 (mA) | RDC max. (Ω) | Type | Samples |
|---|
