IC-Hersteller Renesas
IC-Hersteller (96)
- Alle Hersteller
Analog Devices
Infineon Technologies
Maxim Integrated
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (12)
- Ablic (23)
- Advanced Power (4)
- Allegro Microsystems (83)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (130)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Broadcom (47)
- Cambridge GaN Devices (16)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Dialog Semiconductor (11)
- Diodes Incorporated (219)
- Divimath (8)
- Elmos AG (1)
- EPC (98)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (6)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- Ikanos (3)
- IKON (1)
- Indie Semiconductor (1)
- Innovision Semiconductor Inc (2)
- Intel (80)
- Inventchip Technology (3)
- ISSI (34)
- JoulWatt (20)
- KDPOF (2)
- Kinetic Technology (9)
- Lattice semiconductor Corporation (9)
- Littelfuse (1)
- M3 Technology (M3Tek) (4)
- Macnica (16)
- MaxLinear (175)
- MikroE (7)
- MindCet (1)
- Monolithic Power Systems (879)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (2)
- Nisshinbo Micro Device Inc. (10)
- Nordic Semiconductor (1)
- Novosense Micro (1)
- NXP (312)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (96)
- Pulsiv (18)
- Qorvo (87)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (289)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (90)
- SG-Micro (19)
- Silanna Semiconductor (8)
- Silergy Corporation (29)
- Silicon Laboratory Inc. (90)
- Silicontent Technology (56)
- Silvertel (54)
- Skyworks (31)
- Southchip (6)
- Summit Wireless (1)
- Tagore Tech (4)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (1)
- Valens Semiconductor (18)
- Wise Integration (1)
- Wolfspeed (5)
- Xilinx (18)
- XL Semiconductor (3)
- XYSemi (62)
Renesas RZ/V2MA
Vision AI MPU With Renesas DRP-AI High-efficiency AI Accelerator and OpenCV Image Processing Accelerator Enabling Real-time Object Recognition
Details
| Topologie | Sonstige Topologie |
| IC-Revision | 1.00 |
Beschreibung
This product is an evaluation kit equipped with Renesas Electronics MPU (RZ/V2MA). RZ/V2MA has a power-efficient AI accelerator (DRP-AI) and an OpenCV accelerator for AI pre- and post-processing. The evaluation kit is equipped with a microSD card slot, LPDDR4, eMMC, USB host peripherals, GigabitEthernet, etc., enabling the development of various embedded AIs that require image streaming through these interfaces. It is an open price.
Eigenschaften
- Vision and Artificial Intelligence
- AI Accelerator; DRP-AI at 1.0 TOPS/W class
- OpenCV Accelerator (DRP)
- High Speed Interfaces
- 1x Gigabit Ethernet
- 1x USB3.1 Gen1 Host/Peripheral
- 1x PCIe Gen 2 (2-lane)
- 2x SDIO 3.0
- 1x eMMC 4.5.1
- CPU and DDR Memory Interfaces
- 2x Cortex-A53 up to 1.0GHz
- 32-bit LPDDR4-3200
- Video and Graphics, Display
- H.265/H.264 Multi Codec
- Encoding; h.265 up to 2160p, h.264 up to 1080p
- Decoding; h.265 up to 2160p, h.264 up to 1080p
- Package: FCBGA, 15x15mm 0.5mm pitch
Typische Anwendungen
- AI Accelerator: DRP-AI
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 150040GS73240 | SPEC | 6 Dateien | WL-SMCC SMT Mono-color Chip LED Compact | 525 | Grün | 515 | 800 | 3.2 | InGaN | 120 | – | – | – | 0402 | -40 °C up to +85 °C | – | – | – | 1 | 0.5 | 0.4 | – | Tape and Reel | – | – | – | – | – | – | ||
 | 7427927310 | SPEC | 8 Dateien | WE-CBF SMT-Ferrit | – | – | – | – | – | – | – | – | – | – | 0402 | -55 °C up to +125 °C | – | – | – | 1 | 0.5 | 0.5 | 0.25 | – | 10 | 15 | 800 MHz | 2000 | 0.03 | High Current | ||
 | 885012205061 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 1 nF | ±10% | 50 | 0402 | -55 °C up to +125 °C | 2.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | ||
| 885012105007 | SPEC | 5 Dateien | WCAP-CSGP MLCCs 6.3 V(DC) | – | – | – | – | – | – | – | 2.2 µF | ±20% | 6.3 | 0402 | -55 °C up to +85 °C | 10 | 0.05 GΩ | X5R Klasse II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 150040GS73240 | SPEC | |
| 7427927310 | SPEC | |
| 885012205061 | SPEC | |
| 885012105007 | SPEC |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Muster |
|---|