IC manufacturers Onsemi

IC manufacturers (103)

Onsemi NCP13992 | Demoboard EVBUM2684 / NCP13992UHD300WGEVB

GaN Based Ultra-high Power Density Adapter 300_W

Overview

TopologyOther Topology
Input voltage90-265 V
Output 119 V / 18 A

Description

This evaluation board user manual describes implementation of the 300 W Ultra−high Power Density Adapter and its main parameters; efficiency, no−load input power consumption, transient responses, EMI signature etc. The evaluation board demonstrates ON Semiconductor’s high performance controllers, drivers and discrete semiconductor content capabilities that enable efficient UHPD designs implementation. This reference design includes the Synchronous PFC boost converter which is operating in the Discontinuous Conduction or Critical Conduction Mode (DCM/ CrM) depends on loading and LLC power stage with secondary side synchronous rectification. The PFC front stage is driven by NCP1616 controller, which assures unity power factor and low input current THD. Synchronization of the PFC boost SR switch is secured by the NCP4306 high performance SR controller. The LLC stage operates at 500 kHz switching frequency while nominal load is applied. Power stage is managed by the NCP13992 high performance current mode LLC controller. Thanks to the GaN High Electron Mobility Transistors (HEMT) implemented in both power stages at primary side, the high efficiency is easily maintained despite that system operates at high frequency. GaN Systems’ GS66504B are incorporated as primary side power switches. Synchronous rectifier (SR) stage used in the secondary side composes from NCP4306 and two paralleled 60 V power MOSFETs for each branch. SR MOSFETs and controllers are implemented on the dedicated SR MODULE daughter card to ease main power board PCB design and to achieve maximum efficiency. Ultra−high power density is achieved thanks to the modular design, used controllers/ drivers, GaN HEMT and dedicated power magnetics design. This evaluation board manual focuses mainly on reference design description, adapter operation principles and connections. For more comprehensive information please refer to datasheets of individual parts that have been used.

Features

  • GaN HEMT Based Design with Ultra−high Power Density Up to 32 W/inch3
  • Simple Two Layer PCB Design for all Board Modules
  • 300 W Maximum Power with Peak Power Up to 340 W at Fixed Output Voltage 19 V
  • Wide Input Voltage Range 90 − 265 Vrms
  • Synchronous CrM PFC with using GaN HEMT
  • 500 kHz LLC Stage Incorporated with 600 V HB GaN Driver and High Performance Current Mode LLC Controller
  • Complies with CoC5 Tier2

Products

Order Code
Data­sheet
Replacement Order Code
Simu­lation
Downloads
Status
Product series
R
Tol. R
PRated(W)
TCR(ppm/ °C)
TCR(ppm/ °C)
C
Safety Class
dV/dt(V/µs)
DF @ 1 kHz(%)
RISO
Pitch(mm)
Packaging
Tol. C
Size
Operating Temperature
Q(%)
DF(%)
Ceramic Type
Fl(mm)
IR(mA)
IR 2(mA)
ISAT(mA)
RDC(mΩ)
fres(MHz)
Type
Endurance(h)
IRIPPLE(mA)
ILeak(µA)
Ø D(mm)
IR(A)
L(mH)
RDC max.(mΩ)
VR(mV)
VT(V (AC))
Material
L(mm)
W(mm)
H(mm)
Mount
Samples
WRIS-KSKE Thick Film Resistors, 10 Ω, ±1%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Resistance10 Ω
Resistance±1% 
Rated Power0.25 W
Temperature Coefficient of Resistance (min.)-100 ppm/ °C
Temperature Coefficient of Resistance (max.)100 ppm/ °C
Size0603 
Operating Temperature -55 °C up to +155 °C
Pad Dimension0.3 mm
Rated Current0.15 A
Rated Voltage1581.1 mV
Length1.6 mm
Width0.8 mm
Height0.45 mm
MountSMT 
WE-CMB Common Mode Power Line Choke, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
SizeXS 
Operating Temperature -40 °C up to +125 °C
Rated Current2 A
Inductance1 mH
DC Resistance45 mΩ
Rated Voltage250000 mV
Insulation Test Voltage1500 V (AC)
MaterialMnZn 
Length15 mm
Width7.8 mm
Height18 mm
MountTHT 
WE-CMB Common Mode Power Line Choke, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size
Operating Temperature -40 °C up to +125 °C
Rated Current2.5 A
Inductance3.3 mH
DC Resistance60 mΩ
Rated Voltage250000 mV
Insulation Test Voltage1500 V (AC)
MaterialMnZn 
Length23.5 mm
Width13 mm
Height25.5 mm
MountTHT 
WCAP-FTX2 Film Capacitors, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance680 nF
Safety ClassX2 
Rate of Voltage Rise230 V/µs
Dissipation Factor0.1 %
Insulation Resistance14.71 GΩ
Pitch15 mm
PackagingBulk 
Capacitance±10% 
SizePitch 15 mm 
Operating Temperature -40 °C up to +105 °C
Rated Voltage275000 mV
Length18 mm
Width10 mm
Height16 mm
MountBoxed THT 
WE-FI Leaded Toroidal Line Choke, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -40 °C up to +105 °C
Rated Current4.6 A
Inductance0.09 mH
DC Resistance40 mΩ
Length18.5 mm
Width10.5 mm
MountTHT 
WE-PMI Power Multilayer Inductor, –, – 74479774210
Simu­lation
Downloads
Status PTNi| Production will be discontinued. Expected lifetime: <2 years.
Size0805 
Operating Temperature -40 °C up to +125 °C
Q-Factor18 %
Rated Current900 mA
Rated Current 21300 mA
Saturation Current950 mA
DC Resistance110 mΩ
Self Resonant Frequency90 MHz
TypeLow RDC 
Inductance0.001 mH
DC Resistance137.5 mΩ
Length2 mm
Width1.2 mm
Height1 mm
MountSMT 
WCAP-ATG5 Aluminum Electrolytic Capacitors, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 µF
Pitch2.5 mm
PackagingAmmopack 
Capacitance±20% 
Dissipation Factor14 %
Endurance 2000
Ripple Current145 mA
Leakage Current25 µA
Diameter6.3 mm
Rated Voltage25000 mV
Length11 mm
WCAP-ATG5 Aluminum Electrolytic Capacitors, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance47 µF
Pitch2.5 mm
PackagingAmmopack 
Capacitance±20% 
Dissipation Factor10 %
Endurance 2000
Ripple Current115 mA
Leakage Current23.5 µA
Diameter6.3 mm
Rated Voltage50000 mV
Length11 mm
WCAP-ATG5 Aluminum Electrolytic Capacitors, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 µF
Pitch5 mm
PackagingAmmopack 
Capacitance±20% 
Dissipation Factor15 %
Endurance 2000
Ripple Current104 mA
Leakage Current120 µA
Diameter10 mm
Rated Voltage400000 mV
Length14 mm
WCAP-ATG5 Aluminum Electrolytic Capacitors, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance22 µF
Pitch5 mm
PackagingAmmopack 
Capacitance±20% 
Dissipation Factor15 %
Endurance 2000
Ripple Current162 mA
Leakage Current264 µA
Diameter10 mm
Rated Voltage400000 mV
Length25 mm
WCAP-PTG5 Aluminum Polymer Capacitors, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance330 µF
Pitch5 mm
PackagingAmmopack 
Capacitance±20% 
Dissipation Factor8 %
Endurance 2000
Ripple Current4900 mA
Leakage Current1650 µA
Diameter10 mm
Rated Voltage25000 mV
Length12.5 mm
MountRadial THT 
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance47 pF
Insulation Resistance10 GΩ
Packaging7" Tape & Reel 
Capacitance±5% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Ceramic TypeNP0 Class I 
Pad Dimension0.4 mm
Rated Voltage25000 mV
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 nF
Insulation Resistance10 GΩ
Packaging7" Tape & Reel 
Capacitance±5% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Ceramic TypeNP0 Class I 
Pad Dimension0.4 mm
Rated Voltage25000 mV
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance33 pF
Insulation Resistance10 GΩ
Packaging7" Tape & Reel 
Capacitance±5% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Ceramic TypeNP0 Class I 
Pad Dimension0.4 mm
Rated Voltage50000 mV
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance470 pF
Insulation Resistance10 GΩ
Packaging7" Tape & Reel 
Capacitance±5% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Ceramic TypeNP0 Class I 
Pad Dimension0.4 mm
Rated Voltage50000 mV
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 nF
Insulation Resistance10 GΩ
Packaging7" Tape & Reel 
Capacitance±5% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Ceramic TypeNP0 Class I 
Pad Dimension0.4 mm
Rated Voltage50000 mV
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 nF
Insulation Resistance10 GΩ
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Rated Voltage25000 mV
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Insulation Resistance5 GΩ
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Rated Voltage25000 mV
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance220 nF
Insulation Resistance2.3 GΩ
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Rated Voltage25000 mV
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Insulation Resistance0.5 GΩ
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Rated Voltage25000 mV
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-CSGP MLCCs 50 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 nF
Insulation Resistance10 GΩ
Packaging7" Tape & Reel 
Capacitance±10% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.4 mm
Rated Voltage50000 mV
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-CSGP MLCCs 16 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 µF
Insulation Resistance0.05 GΩ
Packaging7" Tape & Reel 
Capacitance±20% 
Size0603 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor10 %
Ceramic TypeX5R Class II 
Pad Dimension0.4 mm
Rated Voltage16000 mV
Length1.6 mm
Width0.8 mm
Height0.8 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Insulation Resistance5 GΩ
Packaging7" Tape & Reel 
Capacitance±10% 
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.5 mm
Rated Voltage25000 mV
Length2 mm
Width1.25 mm
Height0.8 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Insulation Resistance0.5 GΩ
Packaging7" Tape & Reel 
Capacitance±10% 
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Ceramic TypeX7R Class II 
Pad Dimension0.5 mm
Rated Voltage25000 mV
Length2 mm
Width1.25 mm
Height1.25 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 µF
Insulation Resistance0.05 GΩ
Packaging7" Tape & Reel 
Capacitance±10% 
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Ceramic TypeX7R Class II 
Pad Dimension0.5 mm
Rated Voltage25000 mV
Length2 mm
Width1.25 mm
Height1.25 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance4.7 µF
Insulation Resistance0.02 GΩ
Packaging7" Tape & Reel 
Capacitance±20% 
Size0805 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor10 %
Ceramic TypeX5R Class II 
Pad Dimension0.5 mm
Rated Voltage25000 mV
Length2 mm
Width1.25 mm
Height1.25 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance470 nF
Insulation Resistance1.1 GΩ
Packaging7" Tape & Reel 
Capacitance±10% 
Size1206 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.6 mm
Rated Voltage25000 mV
Length3.2 mm
Width1.6 mm
Height1.15 mm
WCAP-CSGP MLCCs 25 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 µF
Insulation Resistance0.2 GΩ
Packaging7" Tape & Reel 
Capacitance±10% 
Size1206 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Ceramic TypeX7R Class II 
Pad Dimension0.6 mm
Rated Voltage25000 mV
Length3.2 mm
Width1.6 mm
Height1.6 mm
WCAP-CSGP MLCCs 100 V(DC), –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance470 pF
Insulation Resistance10 GΩ
Packaging7" Tape & Reel 
Capacitance±5% 
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Ceramic TypeNP0 Class I 
Pad Dimension0.4 mm
Rated Voltage100000 mV
Length1.6 mm
Width0.8 mm
Height0.8 mm
750344560
Power Inductor, –, –
Simu­lation
Downloads
Status Activei| Production is active. Expected lifetime: >10 years.
Product series Power Inductor