IC manufacturers Onsemi

IC manufacturers (103)

Onsemi NCH-RSL10-101S51 | Demoboard RSL10-SENSE-DB-GEVB Evaluation Board

System-in-Package, Bluetooth® 5 Certified, SDK 3.5

Overview

TopologySensors

Description

The RSL10−SENSE−DB−GEVK is a comprehensive, compact, node−to−cloud IoT sensor platform that allows development of various Bluetooth Low Energy based use cases. Along with the hardware and software, the RSL10−SENSE−GEVK includes a mobile app to interact with sensors and actuators. The board features RSL10, Industry’s lowest power Bluetooth® 5 SoC and several sensors from ON Semiconductor and Bosch. By combining motion, environmental, ambient light sensing with the ultra−low power of the Bluetooth 5 Certified RSL10 and will enable customers to realize a new class of battery powered static, mobile and wearable smart sensors targeting consumer and industrial applications in the IoT. The overall deep sleep consumption of 20 A results in a battery life of over 1 year

Features

  • Fully-Certified to Worldwide Regulatory Standards
  • FCC (U.S)
  • ISED (Canada)
  • CE (Europe)
  • MIC (Japan)
  • KCC (Korea)
  • Ultra-Low-Power:
  • Industry's lowest power consumption in Deep Sleep Mode (62.5 nW) and Rx in Receive Mode (7 mW)
  • Industry's best EEMBC® ULPMark™ scores (1090 ULPMark CP @ 3 V; 1260 @ 2.1 V)
  • Complete Solution
  • Fully-integrated antenna
  • RSL10 Radio SoC
  • All passive components
  • Advanced Multi-Protocol Wireless Functionality
  • Supports Bluetooth Low Energy and 2.4 GHz proprietary/custom protocols
  • Rx Sensitivity: -93 dBm
  • Transmitting Power: -17 to 0 dBm
  • Supports Firmware Over The Air (FOTA) Other Key Technical Features
  • Built-in power management
  • Advanced dual-core architecture
  • 1.1 to 3.3 Voltage Supply Range
  • 384 kB Flash, 76 kB Program Memory, 88 kB Data Memory
  • IP protection feature to secure flash contents
  • Configurable analog and digital sensor interfaces (GPIOs, LSADs, I2C, SPI, PCM)

Typical applications

  • IoT Edge-Node Applications
  • Energy Harvesting
  • Wearables
  • Automotive Applications

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
C
Tol. C
VR(V (DC))
Size
Operating Temperature
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
Samples
WCAP-CSGP MLCCs 16 V(DC), 100 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 50 V(DC), 100 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 6.3 V(DC), 470 nF, ±20%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance470 nF
Capacitance±20% 
Rated Voltage6.3 V (DC)
Size0402 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor10 %
Insulation Resistance0.2 GΩ
Ceramic TypeX5R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel