IC manufacturers Infineon Technologies

IC manufacturers (105)

Infineon Technologies CCG7SC | Demoboard EVAL_XDPS2221E_120W_3C

120 W USB Power Delivery evaluation board demonstrates the XDPS2221E controller and CoolGaN™ switches for multi-port USB PD charging application.

Overview

TopologyFlyback Converter
Input voltage90-264 V
IC revision1.0

Description

The XDP™ XDPS2221E controller is an easy- to-use, highly integrated device including the multimode PFC controller, the hybrid-flyback (HFB) controller, and three gate drivers for the PFC switch and hybrid-flyback switches. The high level of integration for both PFC and HFB stages makes this controller the perfect choice forwide input – wide output applications. One such application is USB PD adapter and battery chargers as presented in this evaluation board. For detailed information about this control IC, see the datasheet [2].A short summary of the product, its main features, the IC pin layout, and the main benefits for the customer is given below.

Features

PFC + Hybrid-flyback + DC/DC-BuckMaximized peak efficiency above 95%Wide output voltage page for USB-PD 3.1120 W output powerCoolGaN™ swithes at PFC and half-bridge3-port PD output with EZ-PD™ CCG7SC

Typical applications

  • USB C charger
  • Complete system solutions for smart TVs

Products

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Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
C
Tol. C
VR(V (DC))
Size
Operating Temperature
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
L(µH)
IRP,40K(A)
ISAT,30%(A)
RDC typ.(mΩ)
RDC max.(mΩ)
fres(MHz)
Mount
SamplesAvailability & Sample
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SPECWCAP-CSGP MLCCs 50 V(DC), 1 nF, ±10%
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
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SPECWCAP-CSGP MLCCs 50 V(DC), 100 nF, ±10%
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
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SPECWCAP-CSGP MLCCs 50 V(DC), 1 µF, ±10%
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.1 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Height1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel 
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SPECWE-XHMI SMT Power Inductor, –, –
Simu­lation
Availability
Status Activei| Production is active. Expected lifetime: >10 years.
Size8080 
Operating Temperature -40 °C up to +125 °C
Length8.8 mm
Width8.3 mm
Height7.8 mm
Inductance6.8 µH
Performance Rated Current10.55 A
Saturation Current @ 30%17.6 A
DC Resistance13 mΩ
DC Resistance14.3 mΩ
Self Resonant Frequency22 MHz
MountSMT 
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