GaN Systems GS66508B / GS66516B / SN6505B | Demoboard GSP665x-EVBIMS2

Description

This horizontal Insulated Metal Substrate (IMS) evaluation platform can be used to evaluate the electrical and thermal performance benefits of GaNPX® bottom-side cooled E-HEMTs in high power applications.The optimized thermal and electrical designs provide a excellent reference for implementing a low cost, high performance design.

Features

• Enhanced thermal and mechanical design
• Ultra low inductance, bottom-cooled GaNPX® package
• Minimizing parasitic elements of the power and gate drive loops via magnetic flux-cancellation
• High performance switching with low EMI
• Scalable and parallelable GaNPX® packaging for applications up to 100 kW
• Low cost thermal solution for high power applications.

Typical applications

• Appliances
• AC-DC Converters, DC-DC Converters, Bridgeless Totem Pole PFC, Inverters, Industrial Motor Drives, Laser Drivers, Wireless,Power Transfer
• Energy Storage Systems, Solar EOn Board Battery Chargers energy
• Uninterruptible Power Supplies

More information

• Datasheet
• IC product information