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Overview
| Topology | Buck Converter |
| Input voltage | 12 V |
| Output 1 | 3.3 V / 2 A |
| IC revision | 1 |
Description
The AmP™ device is an FPGA based platform for creating a custom Power Management Integrated Circuit (PMIC). The AmP device is customized by adding available Power Components designs based on system requirements. AmP device customization is as easy as using WebAmp™ application software to produce a customized PMIC in a very short period of time. AmP devices can be used to power FPGAs, Processors, Microcontrollers, and ASICs by integrating multiple power rails into single chip designs. The AmP device input voltage range is 4.5V to 20V. The AmP device is targeted for wall-powered applications or 2S-4S Li-Ion battery packs. AmP devices have up to 4 additional integrated LDOs of which two are fixed output voltages (3.3V and 1.2V) and two are user programmable.
Features
- AmPMIC enables programmable custom PMIC
- Integrate application targeted Power Components
- Power Blocks for a variety of topologies
- Scalable Integrated N-channel MOSFETs (SIM)
- Current sense for protection, telemetry, regulation
- Build Switching topologies - Buck, Boost, Buck-Boost
- Build Linear topologies - LDO, Load Switch
- Analog fabric connectivity for sensor signals
- Digital μLogic fabric connectivity: Analog/Digital Blocks
- Industry first: Analog Proficiency - Digital Flexibility
Typical applications
- Power Component Integrator, Digital power management IC
More information
Products
Order Code | Datasheet | Simulation | Downloads | Status | Product series | C | Tol. C | VR(V (DC)) | Size | Operating Temperature | Q(%) | DF(%) | RISO | Ceramic Type | L(mm) | W(mm) | H(mm) | Fl(mm) | Packaging | L(µH) | IRP,40K(A) | ISAT,10%(A) | ISAT,30%(A) | RDC(mΩ) | fres(MHz) | Material | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WCAP-CSGP MLCCs 10 V(DC), 10 nF, ±5% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 10 V(DC) | Capacitance10 nF | Capacitance±5% | Rated Voltage10 V (DC) | Size0805 | Operating Temperature -55 °C up to +125 °C | Q-Factor1000 % | – | Insulation Resistance10 GΩ | Ceramic TypeNP0 Class I | Length2 mm | Width1.25 mm | Height1.25 mm | Pad Dimension0.5 mm | Packaging7" Tape & Reel | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), 100 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 50 V(DC) | Capacitance100 nF | Capacitance±10% | Rated Voltage50 V (DC) | Size0805 | Operating Temperature -55 °C up to +125 °C | – | Dissipation Factor2.5 % | Insulation Resistance5 GΩ | Ceramic TypeX7R Class II | Length2 mm | Width1.25 mm | Height0.8 mm | Pad Dimension0.5 mm | Packaging13" Tape & Reel | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 100 V(DC), 10 µF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 100 V(DC) | Capacitance10 µF | Capacitance±10% | Rated Voltage100 V (DC) | Size2220 | Operating Temperature -55 °C up to +125 °C | – | Dissipation Factor2.5 % | Insulation Resistance0.01 GΩ | Ceramic TypeX7R Class II | Length5.7 mm | Width5 mm | Height2.8 mm | Pad Dimension0.85 mm | Packaging7" Tape & Reel | – | – | – | – | – | – | – | |||||
 | WE-HCI SMT Flat Wire High Current Inductor, –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWE-HCI SMT Flat Wire High Current Inductor | – | – | – | Size7040 | Operating Temperature -40 °C up to +150 °C | – | – | – | – | Length7 mm | Width6.9 mm | Height3.8 mm | – | – | Inductance2.2 µH | Performance Rated Current10.2 A | Saturation Current @ 10%5.6 A | Saturation Current @ 30%13 A | DC Resistance11.4 mΩ | Self Resonant Frequency52 MHz | MaterialSuperflux |