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Overview
| Topology | Other Topology |
| IC revision | 1 |
Description
The ARD_X_VRPM_B is a scalable power supply designed to provide power to AMD Versal Premium Upper Loading FPGA devices. The designs is scalable to support the cost- and power-optimized FPGA devices.
Features
- AmPMIC enables programmable custom PMIC
- Integrate application targeted Power Components
- Power Blocks for a variety of topologies
- Scalable Integrated N-channel MOSFETs (SIM)
- Current sense for protection, telemetry, regulation
- Build Switching topologies - Buck, Boost, Buck-Boost
- Build Linear topologies - LDO, Load Switch
- Analog fabric connectivity for sensor signals
- Digital μLogic fabric connectivity: Analog/Digital Blocks
- Industry first: Analog Proficiency - Digital Flexibility
Typical applications
- Power Component Integrator, Digital power management IC
More information
Products
Order Code | Datasheet | Simulation | Downloads | Status | Product series | C | Tol. C | VR(V (DC)) | Size | Operating Temperature | DF(%) | RISO | Ceramic Type | L(mm) | W(mm) | H(mm) | Fl(mm) | Packaging | Samples |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WCAP-CSGP MLCCs 6.3 V(DC), 100 nF, ±20% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 6.3 V(DC) | Capacitance100 nF | Capacitance±20% | Rated Voltage6.3 V (DC) | Size0201 | Operating Temperature -55 °C up to +85 °C | Dissipation Factor15 % | Insulation Resistance0.5 GΩ | Ceramic TypeX5R Class II | Length0.6 mm | Width0.3 mm | Height0.3 mm | Pad Dimension0.15 mm | Packaging7" Tape & Reel | ||||
| WCAP-CSGP MLCCs 6.3 V(DC), 1 µF, ±20% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 6.3 V(DC) | Capacitance1 µF | Capacitance±20% | Rated Voltage6.3 V (DC) | Size0402 | Operating Temperature -55 °C up to +85 °C | Dissipation Factor15 % | Insulation Resistance0.1 GΩ | Ceramic TypeX5R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | ||||
| WCAP-CSGP MLCCs 25 V(DC), 1 µF, ±20% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 25 V(DC) | Capacitance1 µF | Capacitance±20% | Rated Voltage25 V (DC) | Size0603 | Operating Temperature -55 °C up to +85 °C | Dissipation Factor10 % | Insulation Resistance0.5 GΩ | Ceramic TypeX5R Class II | Length1.6 mm | Width0.8 mm | Height0.8 mm | Pad Dimension0.4 mm | Packaging7" Tape & Reel | ||||
| WCAP-CSGP MLCCs 6.3 V(DC), 1 µF, ±20% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 6.3 V(DC) | Capacitance1 µF | Capacitance±20% | Rated Voltage6.3 V (DC) | Size0201 | Operating Temperature -55 °C up to +85 °C | Dissipation Factor15 % | Insulation Resistance0.05 GΩ | Ceramic TypeX5R Class II | Length0.6 mm | Width0.3 mm | Height0.3 mm | Pad Dimension0.15 mm | Packaging7" Tape & Reel | ||||
| WCAP-CSGP MLCCs 6.3 V(DC), 10 µF, ±20% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 6.3 V(DC) | Capacitance10 µF | Capacitance±20% | Rated Voltage6.3 V (DC) | Size0603 | Operating Temperature -55 °C up to +85 °C | Dissipation Factor15 % | Insulation Resistance0.005 GΩ | Ceramic TypeX5R Class II | Length1.6 mm | Width0.8 mm | Height0.8 mm | Pad Dimension0.35 mm | Packaging7" Tape & Reel | ||||
| WCAP-CSGP MLCCs 25 V(DC), 10 µF, ±20% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 25 V(DC) | Capacitance10 µF | Capacitance±20% | Rated Voltage25 V (DC) | Size0603 | Operating Temperature -55 °C up to +85 °C | Dissipation Factor20 % | Insulation Resistance0.01 GΩ | Ceramic TypeX5R Class II | Length1.6 mm | Width0.8 mm | Height0.8 mm | Pad Dimension0.35 mm | Packaging7" Tape & Reel |