| Topologie | LAN / POE |
| IC-Revision | December 2025 |
This reference design accelerates development of multiprotocol 100Mbps industrial Ethernet nodes. The design allows engineers to quickly prototype and deploy EtherCAT®, PROFINET®, EtherNet/IP, and Modbus® Transmission Control Protocol (TCP) on AM261x with Integrated Industrial Communication Subsystem (ICSS). The approach cuts hardware spins, simplifies clocking and power, and delivers deterministic, time-synchronized factory automation performance.
Supports multiple industrial Ethernet protocols: EtherCAT®, PROFINET® Real-Time (RT) and Isochronous Real-Time (IRT), EtherNet/IP®, and Modbus® TCPICSS enabling software-selectable multiprotocol operationSynchronize and latch real-time Ethernet signals for precise timing controlFlexible Host Port Interface (HPI) for connection to an external application processor or for use with a daughter cardEffective reference design for reduced bill of materials (BOM) and compact form factorElectromagnetic Compatibility (EMC) and Electromagnetic Interference (EMI) compatible PCB layout
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR(V (DC)) | Bauform | Betriebstemperatur | DF(%) | RISO | Keramiktyp | L(mm) | B(mm) | H(mm) | Fl(mm) | Verpackung | Z @ 100 MHz(Ω) | Zmax(Ω) | Testbedingung Zmax | IR 2(mA) | RDC max.(Ω) | Typ | Muster | |
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| WCAP-CSGP MLCCs 25 V(DC), 10 µF, ±20% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 25 V(DC) | Kapazität10 µF | Kapazität±20% | Nennspannung25 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +85 °C | Verlustfaktor20 % | Isolationswiderstand0.01 GΩ | KeramiktypX5R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.35 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | |||||
![]() | WE-CBF SMT-Ferrit, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWE-CBF SMT-Ferrit | – | – | – | Bauform0805 | Betriebstemperatur -55 °C up to +125 °C | – | – | – | Länge2 mm | Breite1.2 mm | Höhe0.9 mm | Pad Dimension0.5 mm | – | Impedanz @ 100 MHz30 Ω | Maximale Impedanz55 Ω | Maximale Impedanz1000 MHz | Nennstrom 23000 mA | Gleichstromwiderstand0.025 Ω | TypHochstrom |