Topologie | Sonstige Topologie |
Eingangsspannung | 2.5-6 V |
IC-Revision | E1 |
The TIDA-01051 reference design is used to demonstrate optimized channel density, integration, power consumption, clock distribution and signal chain performance of very high channel count data acquisition (DAQ) systems such as those used in automatic test equipment (ATE). Using serializers, such as TI’s DS90C383B, to combine many simultaneously sampling ADC outputs into several LVDS lines dramatically reduces the number of pins the host FPGA must process. As a result, a single FPGA can process a significantly increased number of DAQ channels and board routing complexity is greatly reduced.
2-A, Low Profile MicroSiP Power ModuleDCS-Control TopologyUp to 95% Efficiency17-µA Operating Quiescent Current–40°C to 125°C Operating Temperature RangeHiccup Short Circuit Protection2.5-V to 6-V Input Voltage Range0.8-V to VIN Adjustable Output VoltagePower Save Mode for Light Load Efficiency100% Duty Cycle for Lowest DropoutOutput Discharge FunctionPower Good OutputIntegrated Soft StartupOver Temperature Protection3.0-mm × 2.8-mm × 1.3-mm 8-Pin µSiL Package
Artikel Nr. | Datenblatt | Simulation | Downloads | Produktserie | Anwendung | PCB/Kabel/Panel | Modularity | Wire Section | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | L (µH) | ISAT (A) | fres (MHz) | Montageart | Ti | Ø ID (mm) | Ø OD (mm) | VPE (pcs) | Pins | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster | |
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691213710002 | SPEC | – | 6 Dateien | WR-TBL Series 213 - 5.00 mm Horiz.l Entry Modular | Rising Cage Clamp | PCB | Ja | 26 to 16 (AWG) 0.5 to 1.5 (mm²) | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | – | 10 | – | – | – | – | – | THT | – | – | – | – | 2 | – | – | – | Horizontal | 10 | Karton | ||
744025006 | SPEC | 8 Dateien | WE-TPC SMT-Speicherdrossel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 2828 | -40 °C up to +125 °C | – | – | – | 2.8 | 2.8 | – | 6.8 | 1.3 | 59 | SMT | – | – | – | 550 | 2 | – | 2.8 | – | – | 1.1 | – | |||
744031680 | SPEC | 8 Dateien | WE-TPC SMT-Speicherdrossel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 3816 | -40 °C up to +125 °C | – | – | – | 3.8 | 3.8 | – | 68 | 0.22 | 12 | SMT | – | – | – | 1000 | 2 | – | 1.65 | – | – | 0.32 | – | |||
150060RS75000 | SPEC | 25 Dateien Strahldaten
| WL-SMCW SMT Mono-color Chip LED Waterclear | – | – | – | – | 625 | Rot | 630 | 250 | 2 | AlInGaP | 140 | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | 1.6 | 0.8 | – | – | – | – | SMT | – | – | – | 4000 | – | – | 0.7 | – | – | – | Tape and Reel | |||
885012006057 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | 100 pF | ±5% | 50 | 0603 | -55 °C up to +125 °C | 1000 | 10 GΩ | NP0 Klasse I | 1.6 | 0.8 | 0.4 | – | – | – | – | – | – | – | 4000 | – | – | 0.8 | – | – | – | 7" Tape & Reel | |||
9774050360R | SPEC | – | 6 Dateien | WA-SMSI SMT Steel Spacer with internal Thread M3 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | -55 °C up to +150 °C | – | – | – | 5 | – | – | – | – | – | – | M3 | 4.2 | 6 | 650 | – | – | – | – | – | – | Tape and Reel | ||
61300211121 | SPEC | – | 6 Dateien | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | 5.08 | – | – | – | – | – | THT | – | – | – | – | 2 | Single | – | Pin Header | Gerade | 3 | Beutel | ||
61300311121 | SPEC | – | 6 Dateien | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | 7.62 | – | – | – | – | – | THT | – | – | – | – | 3 | Single | – | Pin Header | Gerade | 3 | Beutel |
Artikel Nr. | Datenblatt | Simulation | |
---|---|---|---|
691213710002 | SPEC | – | |
744025006 | SPEC | ||
744031680 | SPEC | ||
150060RS75000 | SPEC | ||
885012006057 | SPEC | ||
9774050360R | SPEC | – | |
61300211121 | SPEC | – | |
61300311121 | SPEC | – |
Muster |
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Artikel Nr. | Datenblatt | Simulation | Downloads | Produktserie | Anwendung | PCB/Kabel/Panel | Modularity | Wire Section | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | L (µH) | ISAT (A) | fres (MHz) | Montageart | Ti | Ø ID (mm) | Ø OD (mm) | VPE (pcs) | Pins | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster |
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