IC-Hersteller Texas Instruments

IC-Hersteller (103)

Texas Instruments TPS7A3901DSCR | Demoboard TIDA-010057

Ultrasound smart probe power supply reference design

Details

TopologieSonstige Topologie
IC-RevisionE2

Beschreibung

Significant technological advancements and high degree of integration in Medical imaging, especially hand-held ultrasound smart probes, are pushing engineers to come up with highly-efficient, noise immune power solutions in a small size. This reference design documents end to end power and data solution for our high performance 128-channel Tx/64-channel Rx ultrasound smart probe solution with TX7332 transmit chip and AFE5832LP receive chip. The power tree includes a single-stage transformer-less HV generation (up to +/- 80V & height <5mm) for transmit and the point-of-load LV for the AFEs & FPGA from a 5V USB Type-C™ input. This design enables low-noise (<10mV ripple) efficient rails and better thermal performance (< 10°C temp rise) achieving system efficiency ~80%, receive data SNR > 55dB and ultra-compact size (90mm x 45mm x 20mm). All power rails can be synchronized to an external clock using our integrated buffer-divider CDCE949. This design also supports 1S battery input with a normal ultrasound operation of up to 2 hours.

Eigenschaften

  • Transformer less dual rail HV (±80V @ 25 mA) generation from 5V USB in single stage implementation to meet component height requirement of < 5mm
  • Low ripple and LV supply for the front end and FPGA from a 5V USB Type-C input
  • Compact board size (< 90mm x 45 mm x 20mm)
  • End to End System Efficiency ~80% running at full load
  • SNR > 55dB (Noise Floor below -90dB)
  • EN/DISABLE supplies for power optimization and all rails can be synchronized to external clock
  • Accurate real time power consumption measurement using high performance instrumentation amplifiers INA231
  • High speed data acquisition over USB Type C up to 4.2 Gbps

Typische Anwendungen

  • Ultrasound smart probe

Weiterführende Informationen

Artikeldaten

Artikel Nr.
Daten­blatt
Simu­lation
Downloads
Status
Produktserie
C
Tol. C
VR(V (DC))
Bauform
Betriebstemperatur
DF(%)
RISO
Keramiktyp
L(mm)
B(mm)
H(mm)
Fl(mm)
Verpackung
Z @ 100 MHz(Ω)
Zmax(Ω)
Testbedingung Zmax
IR 2(mA)
RDC max.(Ω)
Typ
Muster
WCAP-CSGP MLCCs 16 V(DC), 10 nF, ±10%
Simu­lation
Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.
Kapazität10 nF
Kapazität±10% 
Nennspannung16 V (DC)
Bauform0402 
Betriebstemperatur -55 °C up to +125 °C
Verlustfaktor3.5 %
Isolationswiderstand10 GΩ
KeramiktypX7R Klasse II 
Länge1 mm
Breite0.5 mm
Höhe0.5 mm
Pad Dimension0.25 mm
Verpackung7" Tape & Reel 
WE-CBF SMT-Ferrit, –, –
Simu­lation
Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.
ProduktserieWE-CBF SMT-Ferrit
Bauform0603 
Betriebstemperatur -55 °C up to +125 °C
Länge1.6 mm
Breite0.8 mm
Höhe0.8 mm
Pad Dimension0.3 mm
Impedanz @ 100 MHz30 Ω
Maximale Impedanz40 Ω
Maximale Impedanz1000 MHz 
Nennstrom 23000 mA
Gleichstromwiderstand0.04 Ω
TypHochstrom