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Texas Instruments TPS543C20A | Demoboard TPS543C20AEVM
TPS543C20AEVM-054 40-A Single Phase Synchronous Step-Down Converter
Details
| Topologie | Abwärtswandler |
| Eingangsspannung | 5-16 V |
| Schaltfrequenz | 500-20000 kHz |
| Ausgang 1 | 0.9 V / 40 A |
Beschreibung
The TPS543C20A uses an internally compensated emulated peak-current-mode control, with a clock synchronizable, fixed-frequency modulator for EMI-sensitive POL. The internal integrator and directly amplifying ramp tracking loop eliminate the need for external compensation over a wide range of frequencies thereby making the system design flexible, dense, and simple. Optional API and body braking help improve transient performance by significantly reducing undershoot and overshoot, respectively. Integrated NexFET™ MOSFETs with low-loss switching facilitate high efficiency and deliver up to 40 A in a 5-mm × 7-mm PowerStack™ package with a layout friendly thermal pad. Two TPS543C20A devices can be stacked together to provide up to 80-A point-of-load.
Eigenschaften
- Internally-Compensated Advanced Current Mode Control 40-A POL
- Input Voltage Range: 4 V to 16 V
- Output Voltage Range: 0.6 V to 5.5 V
- Integrated 3.4/0.9-mΩ Stacked NexFET™ Power Stage With Lossless Low-Side Current Sensing
- Fixed Frequency - Synchronization to an External Clock and/or Sync Out
- Pin Strapping Programmable Switching Frequency
- 300 kHz to 2 MHz for Standalone
- 300 kHz to 1 MHz for Stackable
- Stack 2× for up to 80 A With Current Share, Voltage Share, and CLK Sync
- Pin Strapping Programmable Reference from 0.6V to 1.1 V With 0.5% Accuracy
- Differential Remote Sensing
- Safe Start-Up into Prebiased Output
- High-Accuracy Hiccup Current Limit
- Asynchronous Pulse Injection (API) and Body Braking
- 40-pin, 5-mm × 7-mm LQFN Package with 0.5-mm Pitch and Single Thermal Pad
- Create a Custom Design Using the TPS543C20A With the WEBENCH® Power Designer
Typische Anwendungen
- Wireless and Wired Communications Infrastructure Equipment
- Enterprise Servers, Switches, and Routers, Enterprise Storage, SSD, ASIC, SoC, FPGA, DSP Core, and I/O Rails
Weiterführende Informationen
Artikeldaten
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Pins | PCB/Kabel/Panel | Modularity | Typ | Wire Section | C | Tol. C | VR(V (DC)) | Bauform | Betriebstemperatur | Q(%) | DF(%) | RISO | Keramiktyp | L(mm) | B(mm) | H(mm) | Fl(mm) | Verpackung | L(nH) | LR(nH) | IR(A) | ISAT,10%(A) | ISAT,30%(A) | RDC(mΩ) | fres(MHz) | Material | Endurance(h) | IRIPPLE(mA) | ILeak(µA) | Ø D(mm) | Montageart | Arbeitsspannung(V (AC)) | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | WE-HCM SMT-Hochstrominduktivität, 2, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWE-HCM SMT-Hochstrominduktivität | Pins2 | – | – | – | – | – | – | – | Bauform1390 | Betriebstemperatur -40 °C up to +125 °C | – | – | – | – | Länge14 mm | Breite13 mm | Höhe9 mm | Pad Dimension1.8 mm | – | Induktivität470 nH | Nenninduktivität200 nH | Nennstrom47.5 A | Sättigungsstrom 135.1 A | Sättigungsstrom @ 30%46.8 A | Gleichstromwiderstand0.165 mΩ | Eigenresonanzfrequenz22 MHz | MaterialMnZn | – | – | – | – | MontageartSMT | – | ||||
 | WR-PHD Stiftleisten - Einreihig, 2, – | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWR-PHD Stiftleisten - Einreihig | Pins2 | – | – | TypGerade | – | – | – | – | – | Betriebstemperatur -40 °C up to +105 °C | – | – | Isolationswiderstand1000 MΩ | – | Länge5.08 mm | – | – | – | VerpackungBeutel | – | – | Nennstrom3 A | – | – | – | – | – | – | – | – | – | MontageartTHT | Arbeitsspannung250 V (AC) | |||
 | WR-TBL Serie 2425 - 5.08 mm Horizontal Entry Modular w. Rising Cage Clamp, 4, Käfigzugklemme | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | Pins4 | PCB/Kabel/PanelPCB | ModularityNein | TypHorizontal | Wire Section 12 to 30 (AWG) 3.31 to 0.0509 (mm²) | – | – | – | – | Betriebstemperatur -30 °C up to +120 °C | – | – | – | – | Länge20.32 mm | – | – | – | VerpackungKarton | – | – | Nennstrom24 A | – | – | – | – | – | – | – | – | – | MontageartTHT | Arbeitsspannung250 V (AC) | ||||
 | WCAP-AS5H Aluminum Electrolytic Capacitors, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-AS5H Aluminum Electrolytic Capacitors | – | – | – | – | – | Kapazität330 µF | Kapazität±20% | Nennspannung25 V (DC) | Bauform10.0 x 10.5 | Betriebstemperatur -40 °C up to +105 °C | – | Verlustfaktor16 % | Isolationswiderstand0.30303 MΩ | – | Länge10.5 mm | Breite10.3 mm | – | – | Verpackung15" Tape & Reel | – | – | – | – | – | – | – | – | Endurance 5000 | Rippelstrom375 mA | Leckstrom82.5 µA | Durchmesser10 mm | MontageartV-Chip SMT | – | ||||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | Kapazität22 pF | Kapazität±5% | Nennspannung50 V (DC) | Bauform0402 | Betriebstemperatur -55 °C up to +125 °C | Güte840 % | – | Isolationswiderstand10 GΩ | KeramiktypNP0 Klasse I | Länge1 mm | Breite0.5 mm | Höhe0.5 mm | Pad Dimension0.25 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | Kapazität680 pF | Kapazität±5% | Nennspannung50 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | Güte1000 % | – | Isolationswiderstand10 GΩ | KeramiktypNP0 Klasse I | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 25 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | Kapazität100 nF | Kapazität±10% | Nennspannung25 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor3.5 % | Isolationswiderstand5 GΩ | KeramiktypX7R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | Kapazität100 nF | Kapazität±10% | Nennspannung50 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor3 % | Isolationswiderstand5 GΩ | KeramiktypX7R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 6.3 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 6.3 V(DC) | – | – | – | – | – | Kapazität100 µF | Kapazität±20% | Nennspannung6.3 V (DC) | Bauform1206 | Betriebstemperatur -55 °C up to +85 °C | – | Verlustfaktor10 % | Isolationswiderstand0.001 GΩ | KeramiktypX5R Klasse II | Länge3.2 mm | Breite1.6 mm | Höhe1.6 mm | Pad Dimension0.5 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – |