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Texas Instruments MSP430FR4133IPM | Demoboard TIDA-00838
Heat Cost Allocator with wM-Bus at 868 MHz Reference Design
Details
| Topologie | Sonstige Topologie |
| IC-Revision | 1.0 |
Beschreibung
The TIDA-00838 reference design implements a heat cost allocator system following the EN834 standard with the “two-sensor measurement method". The solution achieves better than 0.5 degrees Celsius accuracy across a range of +20 to +85°C. Two analog temperature sensors are available as matched pairs to eliminate the need for calibration during manufacturing and lowering OEM system cost. Wireless MCU offers wM-Bus support for S-, T- and C-modes (Meter device) at 868MHz and controls the two temperature sensors.
Eigenschaften
Highly accurate temperature sensing across environment conditions: better than 0.5 degrees from +20 to +85°C.CC1310 SimpleLink(TM) Wireless MCU provides single-chip solution for heat measurement and RF communicationsSensor Controller interfaces seamlessly to two matched LMT70A, which eliminate the need for calibration during manufacturing and lower OEM system costExample source code for wM-Bus @868 MHz transmission for S, T and C-modes (“Meter” device) under TI RTOSCost-optimized 2-layer PCB in HCA form factor and a 96-segments 4-MUX LCDCap Touch button on the PCB for LCD on/off
Typische Anwendungen
- Internet of Things (IoT) or Wearable Applications With Precise Temperature Sensing and Sub-1GHz RF Link
- HCAs Compliant to EN834 With wM-Bus RF Protocol at 868 MHz and up to 15-dBm Transmit Output Power
- Water and Heat Meters With wM-Bus at 868 MHz Subsystem and Segment LCD Functionality
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q (%) | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | IR 1 (mA) | IR 2 (mA) | ISAT (mA) | RDC (mΩ) | Endurance (h) | Betriebstemperatur | IRIPPLE (mA) | ILeak (µA) | Raster (mm) | Ø D (mm) | L (µH) | Tol. L | Testbedingung L | Qmin. | Testbedingung Q | RDC max. (mΩ) | IR (mA) | fres (MHz) | Pins | Reihen | H (mm) | Gender | Typ | Verpackung | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 150080GS75000 | SPEC | 7 Dateien | WL-SMCW SMT Mono-color Chip LED Waterclear | 525 | Grün | 515 | 450 | 3.2 | InGaN | 140 | – | – | – | 0805 | -40 °C up to +85 °C | – | – | – | – | 2 | 1.25 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.7 | – | – | Tape and Reel | ||
 | 74479775222A | SPEC | 8 Dateien | WE-PMI Power-Multilayer-Induktivität | – | – | – | – | – | – | – | – | – | – | 0805 | -40 °C up to +125 °C | 23 | – | – | – | 2 | 1.2 | – | 700 | 1000 | 700 | 200 | – | -40 °C bis zu +125 °C | – | – | – | – | 2.2 | ±20% | 1 MHz/ 5 mA | – | – | 250 | – | 50 | 2 | – | 1 | – | Low RDC | – | ||
| 74479777268 | SPEC | 8 Dateien | WE-PMI Power-Multilayer-Induktivität | – | – | – | – | – | – | – | – | – | – | 0805 | -40 °C up to +125 °C | 17 | – | – | – | 2 | 1.2 | – | 600 | 900 | 200 | 300 | – | -40 °C bis zu +125 °C | – | – | – | – | 6.8 | ±20% | 1 MHz/ 5 mA | – | – | 375 | – | 40 | 2 | – | 1.25 | – | Low RDC | – | ||
 | 744765068A | SPEC | 9 Dateien | WE-KI Keramik-SMT-Induktivität | – | – | – | – | – | – | – | – | – | – | 0402A | -40 °C up to +125 °C | – | – | – | – | 1 | 0.55 | – | – | – | – | – | – | – | – | – | – | – | 0.0068 | ±5% | 250 MHz | 20 | 250 MHz | 83 | 680 | – | – | – | 0.5 | – | – | – | ||
| 744765075A | SPEC | 9 Dateien | WE-KI Keramik-SMT-Induktivität | – | – | – | – | – | – | – | – | – | – | 0402A | -40 °C up to +125 °C | – | – | – | – | 1 | 0.55 | – | – | – | – | – | – | – | – | – | – | – | 0.0075 | ±5% | 250 MHz | 25 | 250 MHz | 104 | 680 | – | – | – | 0.5 | – | – | – | ||
| 744765112A | SPEC | 9 Dateien | WE-KI Keramik-SMT-Induktivität | – | – | – | – | – | – | – | – | – | – | 0402A | -40 °C up to +125 °C | – | – | – | – | 1 | 0.55 | – | – | – | – | – | – | – | – | – | – | – | 0.012 | ±5% | 250 MHz | 26 | 250 MHz | 120 | 640 | – | – | – | 0.5 | – | – | – | ||
| 744765118A | SPEC | 9 Dateien | WE-KI Keramik-SMT-Induktivität | – | – | – | – | – | – | – | – | – | – | 0402A | -40 °C up to +125 °C | – | – | – | – | 1 | 0.55 | – | – | – | – | – | – | – | – | – | – | – | 0.018 | ±5% | 250 MHz | 25 | 250 MHz | 230 | 420 | – | – | – | 0.5 | – | – | – | ||
 | 860080275017 | SPEC | 7 Dateien | WCAP-ATLI Aluminium-Elektrolytkondensatoren | – | – | – | – | – | – | – | 1200 µF | ±20% | 10 | – | – | – | 14 | – | – | 20 | – | – | – | – | – | – | 5000 | -55 °C bis zu +105 °C | 1560 | 120 | 5 | 10 | – | – | – | – | – | – | – | – | – | – | – | – | – | Ammopack | ||
 | 885012005049 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 1 pF | ±0.5pF | 50 | 0402 | -55 °C up to +125 °C | 420 | – | 10 GΩ | NP0 Klasse I | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | – | 7" Tape & Reel | ||
| 885012005052 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 3.3 pF | ±0.5pF | 50 | 0402 | -55 °C up to +125 °C | 466 | – | 10 GΩ | NP0 Klasse I | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | – | 7" Tape & Reel | ||
| 885012205037 | SPEC | 5 Dateien | WCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | 100 nF | ±10% | 16 | 0402 | -55 °C up to +125 °C | – | 5 | 5 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | – | 7" Tape & Reel | ||
| 885012205061 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 1 nF | ±10% | 50 | 0402 | -55 °C up to +125 °C | – | 2.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | – | 7" Tape & Reel | ||
| 885012105007 | SPEC | 5 Dateien | WCAP-CSGP MLCCs 6.3 V(DC) | – | – | – | – | – | – | – | 2.2 µF | ±20% | 6.3 | 0402 | -55 °C up to +85 °C | – | 10 | 0.05 GΩ | X5R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | -55 °C bis zu +85 °C | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | – | 7" Tape & Reel | ||
| 885012105012 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | 1 µF | ±20% | 10 | 0402 | -55 °C up to +85 °C | – | 15 | 0.05 GΩ | X5R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | -55 °C bis zu +85 °C | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | – | 7" Tape & Reel | ||
 | 62131021021 | SPEC | – | 6 Dateien | WR-PHD 1.27 mm SMT Dual Pin Header, H=3.80 mm | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | 500 MΩ | – | 6.35 | – | – | – | – | – | – | – | – | – | – | 1.27 | – | – | – | – | – | – | – | 1000 | – | 10 | Dual | – | Pin Header | Gerade | Tape and Reel with Cap | |
 | 61300211121 | SPEC | – | 6 Dateien | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | 5.08 | – | – | – | – | – | – | – | – | – | – | 2.54 | – | – | – | – | – | – | – | 3000 | – | 2 | Single | – | Pin Header | Gerade | Beutel | |
| 61300311121 | SPEC | – | 6 Dateien | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | 7.62 | – | – | – | – | – | – | – | – | – | – | 2.54 | – | – | – | – | – | – | – | 3000 | – | 3 | Single | – | Pin Header | Gerade | Beutel | |
| 61300411121 | SPEC | – | 6 Dateien | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | 10.16 | – | – | – | – | – | – | – | – | – | – | 2.54 | – | – | – | – | – | – | – | 3000 | – | 4 | Single | – | Pin Header | Gerade | Beutel |
| Muster |
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| Artikel Nr. | Datenblatt | Simulation | Downloads | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q (%) | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | IR 1 (mA) | IR 2 (mA) | ISAT (mA) | RDC (mΩ) | Endurance (h) | Betriebstemperatur | IRIPPLE (mA) | ILeak (µA) | Raster (mm) | Ø D (mm) | L (µH) | Tol. L | Testbedingung L | Qmin. | Testbedingung Q | RDC max. (mΩ) | IR (mA) | fres (MHz) | Pins | Reihen | H (mm) | Gender | Typ | Verpackung | Muster |
|---|