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Texas Instruments LMG2100R044 | Demoboard TIDA-010936
48V/16A small form factor three-phase GaN inverter reference design for integrated motor drives
Details
| Topologie | Inverswandler |
| Eingangsspannung | 12-60 V |
| Schaltfrequenz | 40-100 kHz |
| Ausgang 1 | 48 V / 17 A |
| IC-Revision | A |
Beschreibung
This reference design demonstrates a high-power density 12V to 60V 3-phase power stage using three LMG2100R044 100V, 35A GaN half-bridges with integrated GaN FETs, driver and bootstrap diode specifically for motor-integrated servo drives and robotics applications. Accurate phase-current sensing is achieved through the IN241A current sense amplifier, DC-link and phase voltages are also measured allowing validation of advanced sensorless designs, such as the InstaSPIN-FOC™. The design offers a TI BoosterPack compatible 3.3-V I/O interface to connect to a C2000™ MCU LaunchPad™ development kit or Sitara™ microcontrollers for quick and easy performance evaluation of our GaN technology.
Eigenschaften
High efficiency (99.3% peak) at 40kHz PWM enables operation at 25C ambient and up to 16Arms continuous current without heatsink
Small form factor GaN half-bridge power stage enables high power density and simplifies PCB layoutGaN half-bridge enables operation at higher PWM frequencies to help reduce DC-bus capacitor height while replacing electrolytics with ceramic capacitorsZero reverse recovery losses reduce switch node oscillations
Low dead time of 16.6ns minimize phase voltage distortions Precision phase current sense with ±33A range using 1-mΩ shunt and current sense amplifier with high PWM rejection
Typische Anwendungen
- LLC converters
- Power tools
- Telecom and server power
- Buck, boost, buck-boost converters
- Motor drives
- Solar inverters
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | L (µH) | IRP,40K (A) | ISAT,10% (A) | ISAT,30% (A) | fres (MHz) | Montageart | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 150060GS75000 | SPEC | 26 Dateien Strahldaten
| Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | 525 | Grün | 515 | 430 | 3.2 | InGaN | 140 | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | 1.6 | 0.8 | 0.7 | – | Tape and Reel | – | – | – | – | – | SMT | – | – | – | – | – | – | ||
 | 74279272 | SPEC | 10 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-CBF SMT-Ferrit | – | – | – | – | – | – | – | – | – | – | 0402 | -55 °C up to +125 °C | – | – | – | 1 | 0.5 | 0.5 | 0.25 | – | – | – | – | – | – | SMT | 300 | 400 | 380 MHz | 700 | 0.8 | Breitband | ||
 | 74437324220 | SPEC Anstehende PCNAufgrund einer anstehenden PCN wird in Kürze eine Änderung am Bauteil durchgeführt. Anbei finden Sie die entsprechende PCN. Bei weiteren Fragen wenden Sie sich bitte an Ihren Vertriebsmitarbeiter. | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-LHMI SMT Speicherdrossel | – | – | – | – | – | – | – | – | – | – | 4020 | -40 °C up to +125 °C | – | – | – | 4.45 | 4.06 | 1.8 | – | – | 22 | 1.3 | 1.45 | 2.35 | 14 | SMT | – | – | – | – | 0.5 | – | ||
 | 885012206036 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | 2.2 nF | ±10% | 16 | 0603 | -55 °C up to +125 °C | 3.5 | 10 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.8 | 0.4 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 150060GS75000 | SPEC | |
| 74279272 | SPEC | |
| 74437324220 | SPEC Anstehende PCNAufgrund einer anstehenden PCN wird in Kürze eine Änderung am Bauteil durchgeführt. Anbei finden Sie die entsprechende PCN. Bei weiteren Fragen wenden Sie sich bitte an Ihren Vertriebsmitarbeiter. | |
| 885012206036 | SPEC |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | L (µH) | IRP,40K (A) | ISAT,10% (A) | ISAT,30% (A) | fres (MHz) | Montageart | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Muster |
|---|
