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Details
| Topologie | Sonstige Topologie |
| IC-Revision | 1.0 |
Beschreibung
The STEVAL-HILE1G4K1 evaluation kit includes an emulator board based on the Stellar E1 MCU and a control board featuring the STM32G474RE MCU.Designed for safe, low-voltage emulation of digital power converters, it enables verification of control algorithms by simulating a virtual power circuit where the real controller interacts under both normal and fault conditions, eliminating the risk to physical power hardware.The HIL board emulates the complete power conversion system, including AC and DC sources, converter power stages, and loads.It supports multiple converter types such as three-phase PFC and isolated DC-DC converters, covering topologies like the Vienna rectifier, 3-Level T-type, 3-Phase 2-Level (B6), and dual active bridge (DAB) converters.A dedicated software GUI offers intuitive real-time visualization and analysis of critical parameters and signals, enabling users to monitor system performance, detect anomalies, and fine-tune control algorithms efficiently. The interface supports customizable dashboards, signal logging, and interactive controls to facilitate comprehensive debugging and validation throughout the development process.This kit significantly reduces development time and costs by enabling early-stage testing and debugging of power converter control strategies in a risk-free environment.
Eigenschaften
Model-based power plant emulationHigh simulation accuracy for AFE and VSI (maximum simulation frequency: 100 kHz)Extensive onboard I/Os: 12x PWM inputs, 20x DAC outputsFault injection supportAC and DC overvoltageAC and DC overcurrentUser interface: pushbuttons, LEDs, potentiometersGrid and relay status monitoringGrid and load activation and settingGUI for real time monitoring and efficient debugging
Typische Anwendungen
- Power supplies and converters
Weiterführende Informationen
Artikeldaten
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ.(nm) | Farbe | λPeak typ.(nm) | IV typ.(mcd) | VF typ.(V) | Chiptechnologie | 2θ50% typ.(°) | C | Tol. C | VR(V (DC)) | Bauform | Betriebstemperatur | Q(%) | DF(%) | RISO | Keramiktyp | L(mm) | B(mm) | H(mm) | Fl(mm) | Verpackung | Endurance(h) | IRIPPLE(mA) | ILeak(µA) | Ø D(mm) | Pins | Montageart | IR(mA) | Arbeitsspannung(V (AC)) | Z @ 100 MHz(Ω) | Zmax(Ω) | Testbedingung Zmax | IR 2(mA) | RDC max.(Ω) | Typ | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | WL-SMCW SMT Mono-color Chip LED Waterclear, 525 nm, Grün | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWL-SMCW SMT Mono-color Chip LED Waterclear | dominante Wellenlänge [typ.]525 nm | FarbeGrün | Spitzen-Wellenlänge [typ.]515 nm | Lichtstärke [typ.]450 mcd | Durchlassspannung [typ.]3.2 V | ChiptechnologieInGaN | Abstrahlwinkel Phi 0° [typ.]140 ° | – | – | – | Bauform0805 | Betriebstemperatur -40 °C up to +85 °C | – | – | – | – | Länge2 mm | Breite1.25 mm | Höhe0.7 mm | – | VerpackungTape and Reel | – | – | – | – | – | MontageartSMT | – | – | – | – | – | – | – | – | ||||
 | WE-CBF SMT-Ferrit, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWE-CBF SMT-Ferrit | – | – | – | – | – | – | – | – | – | – | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | – | – | – | – | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.3 mm | – | – | – | – | – | – | MontageartSMT | Nennstrom500 mA | – | Impedanz @ 100 MHz120 Ω | Maximale Impedanz200 Ω | Maximale Impedanz510 MHz | Nennstrom 21350 mA | Gleichstromwiderstand0.3 Ω | TypBreitband | ||||
 | WCAP-AS5H Aluminum Electrolytic Capacitors, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-AS5H Aluminum Electrolytic Capacitors | – | – | – | – | – | – | – | Kapazität10 µF | Kapazität±20% | Nennspannung16 V (DC) | Bauform4.0 x 5.5 | Betriebstemperatur -40 °C up to +105 °C | – | Verlustfaktor22 % | Isolationswiderstand5.33333 MΩ | – | Länge5.5 mm | Breite4.3 mm | – | – | Verpackung15" Tape & Reel | Endurance 5000 | Rippelstrom17 mA | Leckstrom3 µA | Durchmesser4 mm | – | MontageartV-Chip SMT | – | – | – | – | – | – | – | – | ||||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | Kapazität100 pF | Kapazität±5% | Nennspannung50 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | Güte1000 % | – | Isolationswiderstand10 GΩ | KeramiktypNP0 Klasse I | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 16 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | Kapazität100 nF | Kapazität±10% | Nennspannung16 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor3.5 % | Isolationswiderstand5 GΩ | KeramiktypX7R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 25 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | Kapazität1 µF | Kapazität±10% | Nennspannung25 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor10 % | Isolationswiderstand0.5 GΩ | KeramiktypX7R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | Kapazität2.2 nF | Kapazität±10% | Nennspannung50 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor2.5 % | Isolationswiderstand10 GΩ | KeramiktypX7R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | Kapazität470 nF | Kapazität±10% | Nennspannung50 V (DC) | Bauform0805 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor3 % | Isolationswiderstand1.1 GΩ | KeramiktypX7R Klasse II | Länge2 mm | Breite1.25 mm | Höhe1.25 mm | Pad Dimension0.5 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
 | WR-PHD Stiftleisten - Einreihig, –, – | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWR-PHD Stiftleisten - Einreihig | – | – | – | – | – | – | – | – | – | – | – | Betriebstemperatur -40 °C up to +105 °C | – | – | Isolationswiderstand1000 MΩ | – | Länge10.16 mm | – | – | – | VerpackungBeutel | – | – | – | – | Pins4 | MontageartTHT | Nennstrom3000 mA | Arbeitsspannung250 V (AC) | – | – | – | – | – | TypGerade |