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STMicroelectronics ST715PU33R | Demoboard X-NUCLEO-DRP1M
High input voltage, 85 mA LDO linear regulator
Details
| Topologie | USB |
| Eingangsspannung | 2.5-24 V |
| IC-Revision | 1 |
Beschreibung
The X-NUCLEO-DRP1M1 expansion board allows evaluating the features ofTCPP03-M20 and the USB Type-C™ features and protections required for VBUS and CC lines suitable for dual role power (DRP) applications.The expansion board can be stacked on top of any STM32 Nucleo-64 with PowerDelivery (UCPD) peripheral embedded in their microcontrollers.The X-NUCLEO-DRP1M1 effectively demonstrates the dead battery and Sinkoperation, thanks to the integrated ST715PU33R LDO linear regulator that supplies the connected STM32 Nucleo development board.It also demonstrates USB Type-C™ Source operation when a compatible external Source is connected to the board.Moreover,the expansion board allows Dual Role Data functionalities for sourcing devices.The X-NUCLEO-DRP1M1 is compliant with the USB Type-C™ and Power Deliveryspecifications 3.1 standard power range (SPR) and is USB-IF certified as a 100 WDRP solution supporting programmable power supply (PPS).The companion software package (X-CUBE-TCPP) contains the applicationexamples for development boards embedding UCPD-based microcontrollers(NUCLEO-G071RB, NUCLEO-G474RE and NUCLEO-G0B1RE).
Eigenschaften
- Support for all USB Type-C™ Power Delivery SPR profiles up to 100 W
- Management of Dual Role Data/Power configuration
- USB 2.0 Dual Role Data compliant according to STM32 USB data capability
- 8/20 μs surge, overvoltage, overcurrent protection and discharge for VBUS
- Short to VBUS protection for CC1 and CC2 configuration channel pins
- ESD protection (IEC61000-4-2 level 4 ± 8 kV contact discharge) for CC1, CC2,D+ and D-
- Overvoltage, overcurrent protection and discharge for VCONN
- Common mode filter on D+/D- data lines
- Three power modes to optimize current consumption
- Compliant with Programmable Power Supplies (PPS)
- Free comprehensive development firmware library
- Compliant with STM32 Nucleo-64 boards featuring an STM32 with UCPD
Typische Anwendungen
- Mobile phones, Personal digital assistant (PDAs), Cordless phones
- similar battery-powered systems
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Anwendung | Interface typ | Montageart | IR 1 (A) | Arbeitsspannung (V (AC)) | Pins | Reihen | H (mm) | G (mm) | Gender | Typ | IR (A) | Verpackung | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 150060BS75000 | SPEC | 25 Dateien Strahldaten
| WL-SMCW SMT Mono-color Chip LED Waterclear | 470 | Blau | 465 | 145 | 3.2 | InGaN | 140 | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | 1.6 | 0.8 | – | – | – | SMT | – | – | – | – | 0.7 | – | – | – | – | Tape and Reel | ||
 | 150060GS75020 | SPEC | 6 Dateien | WL-SMCW SMT Mono-color Chip LED Waterclear | 525 | Grün | 515 | 700 | 3.2 | InGaN | 140 | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | 1.6 | 0.8 | – | – | – | SMT | – | – | – | – | 0.25 | – | – | – | – | – | ||
 | 150060SS75020 | SPEC | 6 Dateien | WL-SMCW SMT Mono-color Chip LED Waterclear | 630 | Superrot | 645 | 70 | 1.9 | AlInGaP | 140 | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | 1.6 | 0.8 | – | – | – | SMT | – | – | – | – | 0.25 | – | – | – | – | – | ||
 | 885012205058 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 330 pF | ±10% | 50 | 0402 | -55 °C up to +125 °C | 2.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | 0.5 | – | – | – | – | 7" Tape & Reel | ||
| 885012105004 | SPEC | 5 Dateien | WCAP-CSGP MLCCs 6.3 V(DC) | – | – | – | – | – | – | – | 470 nF | ±20% | 6.3 | 0402 | -55 °C up to +85 °C | 10 | 0.2 GΩ | X5R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | 0.5 | – | – | – | – | 7" Tape & Reel | ||
 | 61300611821 | SPEC | – | 6 Dateien | WR-PHD 2.54 mm Socket Header | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | 15.74 | – | – | – | – | THT | – | 250 | 6 | Single | – | – | Socket Header | Gerade | 3 | Tray | |
| 61301011821 | SPEC | – | 6 Dateien | WR-PHD 2.54 mm Socket Header | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | 25.9 | – | – | – | – | THT | – | 250 | 10 | Single | – | – | Socket Header | Gerade | 3 | Tray | |
 | 632723300011 | SPEC | – | 6 Dateien | WR-COM USB 3.1 Type C Receptacle Horizontal THR / SMT | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | – | – | – | USB 3.1 | Type C | THR | – | 20 | 24 | – | – | 1.9 | Receptacle | Horizontal | 5 | Tape and Reel | |
 | 61300421121 | SPEC | – | 6 Dateien | WR-PHD 2.54 mm THT Dual Pin Header | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | 5.08 | – | – | – | – | THT | – | 250 | 4 | Dual | – | – | Pin Header | Gerade | 3 | Beutel | |
| 61300811821 | SPEC | – | 6 Dateien | WR-PHD 2.54 mm Socket Header | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | 20.82 | – | – | – | – | THT | – | 250 | 8 | Single | – | – | Socket Header | Gerade | 3 | Tray | |
| 61300821121 | SPEC | – | 6 Dateien | WR-PHD 2.54 mm THT Dual Pin Header | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | 10.16 | – | – | – | – | THT | 3 | 250 | 8 | Dual | – | – | Pin Header | Gerade | 3 | Beutel | |
| 885012205085 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | 100 nF | ±10% | 25 | 0402 | -55 °C up to +125 °C | 10 | 5 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | 0.5 | – | – | – | – | 7" Tape & Reel |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Anwendung | Interface typ | Montageart | IR 1 (A) | Arbeitsspannung (V (AC)) | Pins | Reihen | H (mm) | G (mm) | Gender | Typ | IR (A) | Verpackung | Muster |
|---|