Topologie | FPGA |
IC-Revision | B1 |
The S32K3X4EVB-T172 is an evaluation and development board for general-purpose industrial and automotive applications.Based on the 32-bit Arm® Cortex®-M7 S32K3 MCU in a 172 HDQFP package, the S32K3X4EVB-T172 offers dual cores configured in lockstep mode, ASIL D safety hardware, HSE security engine, OTA support, advanced connectivity and low power.The S32K3X4EVB-T172 offers a standard-based form factor compatible with the Arduino® UNO pin layout, providing a broad range of expansion board options for quick application prototyping and demonstration.
Hardware FeaturesPower supply switchUser RGB LED2x user push-buttonsADC rotary potentiometer2x touch pad electrodeSoftware FeaturesFree-of-charge S32 Design Studio IDE (Eclipse, GCC and debugger) and S32 Config Tool (pins, clocks, peripherals, DDR) with third-party compilers and debuggersFree-of-charge real-time drivers for AUTOSAR® and non-AUTOSAR use and ASIL D compliantConfiguration tools for both AUTOSAR and non-AUTOSAR usersFree-of-charge security firmware: SHE+ compliant NXP supplied, designed for ISO 21434S32 Safety Software Framework (SAF): Six fault detection and reaction librariesFree of charge Safety Peripheral Drivers (SPD)Structural Core Self-Test (SCST)Free of charge Inter-Platform Communication Framework (IPCF): Middleware for multi-core, multi-OS communication in single- and multi-chip systemsFree of charge Model-Based Design Toolbox for MATLAB®: NXP supplied plug-in for Simulink® environmentProgramming Debug InterfacesOn-board S32K3 debug interface20-Pin Cortex debug + ETM connector10-Pin JTAG connector for S32K3 debug interface10-Pin JTAG connector for TJA1103 Ethernet PHY interfaceCompatibilityArduino UNO pint-out compatible with expansion “shield” supportInterfacesOn-board Secure HS-CAN2x on-board LINEthernet 100BASE-T1 physical layerMicro USB debug interface with virtual COM port
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Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Pins (pcs) | Anwendung | PCB/Kabel/Panel | Modularity | Typ | Wire Section | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | L (µH) | IRP,40K (A) | ISAT,10% (A) | ISAT,30% (A) | RDC max. (mΩ) | fres (MHz) | Montageart | C | VR (V (DC)) | Endurance (h) | IRIPPLE (mA) | Z (mΩ) | ILeak (µA) | DF (%) | Ø D (mm) | L (mm) | Verpackung | Muster |
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