IC-Hersteller EPC
IC-Hersteller (104)
- Alle Hersteller
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (28)
- Ablic (23)
- Acco Semiconductor (1)
- Advanced Power (4)
- Allegro Microsystems (97)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (204)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (45)
- Cambridge GaN Devices (18)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (254)
- Divimath (8)
- Elmos AG (1)
- EPC (135)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (8)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- IKON (1)
- Indie Semiconductor (8)
- Innovision Semiconductor Inc (2)
- Intel (68)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (3)
- Kinetic Technology (8)
- Lattice semiconductor Corporation (30)
- Littelfuse (1)
- Lumissil Microsystems (8)
- M3 Technology (M3Tek) (7)
- Macnica (22)
- Marvell Semiconductor (1)
- MaxLinear (181)
- Menlo Micro (1)
- MikroE (21)
- MindCet (2)
- Monolithic Power Systems (979)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (38)
- Nisshinbo Micro Device Inc. (10)
- Nordic Semiconductor (1)
- Novosense Micro (1)
- NXP (327)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (115)
- Powermat (1)
- Pulsiv (19)
- Qorvo (95)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (297)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (87)
- SG-Micro (49)
- SiFive (2)
- Silanna Semiconductor (9)
- Silergy Corporation (30)
- Silicon Laboratory Inc. (103)
- Silicontent Technology (59)
- Silvertel (60)
- Skycore Semiconductors (1)
- Skyworks (33)
- Southchip (8)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (30)
- Wise Integration (1)
- Wolfspeed (22)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
Details
| Topologie | SEPIC Buck-Boost Topologie |
| Schaltfrequenz | 6102-7458 kHz |
| IC-Revision | 1.0 |
Beschreibung
The EPC9120 wireless power demonstration system is a high efficiency, AirFuel™ Alliance compatible, wireless power transfer demonstration kit capable of delivering up to 33 W into a transmit coil while operating at 6.78 MHzThe popularity of highly resonant wireless power transfer is increasing rapidly, particularly for applications targeting portable device charging. The end applications are varied and evolving quickly from cell phone charging, to handheld tablets, and laptop computers. The EPC9120 kit, capable of delivery up to 33 W supports all of these applications.
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q (%) | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | L (nH) | Tol. L | Testbedingung L | Qmin. (%) | Testbedingung Q | RDC max. (mΩ) | IR (A) | fres (GHz) | Pins (pcs) | Raster (mm) | Reihen | Gender | Typ | Farbe | Montageart | IR 1 (A) | Arbeitsspannung (V (AC)) | PCB/Kabel/Panel | Kontaktwiderstand (mΩ) | Tol. R | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 885012005057 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | 22 pF | ±5% | 50 | 0402 | -55 °C up to +125 °C | 840 | – | 10 GΩ | NP0 Klasse I | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012205052 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | 22 nF | ±10% | 25 | 0402 | -55 °C up to +125 °C | – | 3.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012205037 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 16 V(DC) | 100 nF | ±10% | 16 | 0402 | -55 °C up to +125 °C | – | 5 | 5 GΩ | X7R Klasse II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012206076 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | 1 µF | ±10% | 25 | 0603 | -55 °C up to +125 °C | – | 10 | 0.5 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.8 | 0.4 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012207103 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | 1 µF | ±10% | 50 | 0805 | -55 °C up to +125 °C | – | 10 | 0.1 GΩ | X7R Klasse II | 2 | 1.25 | 1.25 | 0.5 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
 | 744912182 | SPEC | 11 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-CAIR Luftspulen | – | – | – | 4248 | -40 °C up to +125 °C | – | – | – | – | 4.83 | 3.81 | 4.2 | – | – | 82 | ±5% | 150 MHz | 100 | 150 MHz | 9.4 | 2.5 | 1.3 | – | – | – | – | – | – | SMT | – | – | – | – | – | ||
 | 60900213421 | SPEC | – | 3 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD Jumper | – | – | – | – | -40 °C up to +125 °C | – | – | 1000 MΩ | – | 2.44 | – | – | – | Beutel | – | – | – | – | – | – | 3 | – | 1 | 2.54 | – | Jumper | – | Schwarz | – | – | 250 | – | 20 | max. | |
 | 61300111121 | SPEC | – | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD Pin Header - Single | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | 2.54 | – | – | – | Beutel | – | – | – | – | – | – | 3 | – | 1 | 2.54 | Single | Stiftleiste | Gerade | – | THT | – | 250 | – | 20 | max. | |
 | 61300211121 | SPEC | – | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD Pin Header - Single | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | 5.08 | – | – | – | Beutel | – | – | – | – | – | – | 3 | – | 2 | 2.54 | Single | Stiftleiste | Gerade | – | THT | – | 250 | – | 20 | max. | |
 | 645002114822 | SPEC | – | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-WTB 3.96 mm Male Header | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | 7.92 | – | – | – | Beutel | – | – | – | – | – | – | 7 | – | 2 | 3.96 | – | Männlich | Vertikal | Weiß | THT | 7 | 250 | PCB | 20 | max. |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 885012005057 | SPEC | |
| 885012205052 | SPEC | |
| 885012205037 | SPEC | |
| 885012206076 | SPEC | |
| 885012207103 | SPEC | |
| 744912182 | SPEC | |
| 60900213421 | SPEC | – |
| 61300111121 | SPEC | – |
| 61300211121 | SPEC | – |
| 645002114822 | SPEC | – |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q (%) | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | L (nH) | Tol. L | Testbedingung L | Qmin. (%) | Testbedingung Q | RDC max. (mΩ) | IR (A) | fres (GHz) | Pins (pcs) | Raster (mm) | Reihen | Gender | Typ | Farbe | Montageart | IR 1 (A) | Arbeitsspannung (V (AC)) | PCB/Kabel/Panel | Kontaktwiderstand (mΩ) | Tol. R | Muster |
|---|
