IC-Hersteller AnDAPT Inc

IC-Hersteller (103)

AnDAPT Inc AmP8DB6QF65 | Demoboard AmP8XEB1 (ARD_X_ZUM_C1_IC1)

Xilinx Zynq UltraScale+ MPSoC Performance Optimized Reference Design PMIC

Details

TopologieAbwärtswandler
Eingangsspannung12 V
Ausgang 11.8 V / 1.34 A

Beschreibung

The ARD_X_ZUM_C1 is a scalable power supply designed to provide power to Xilinx Zynq UltraScale+ (ZU+) MPSoC Performance optimized FPGAs.The design is scalable to support the most basic ZU2CG device with a dual-core Arm Cortex-53 application processor and dual-core Arm Cortex-R5F real-time processor to ZU19EG products that have graphics processing capabilities (GPUs) to ZU5EV devices with quad-core Arm Cortex-A53 application processor and dual-core Arm Cortex-R5 real-time processor with video processing abilities.

Eigenschaften

  • Design supplies all 31 voltage rails (Figure 1) to Xilinx ZU+ MPSoC device using two AnDAPT PMIC (Figure 3) containing-
  • Seven sync buck switchers (C200) of 6 A capacity each
  • One DrMOS controller (C860) and DrMOS IC of 40 A capacity
  • Two LDOs (C710) of 2 A capacity
  • Inbuilt sequencer (C420) meeting Xilinx turn-on and turnoff timing requirements
  • Soft start/shut-down
  • Only one input 12 V (±10%) required
  • Adjustable output voltage with down to 2.4 mV resolution
  • 1% voltage accuracy
  • Efficiency up to 90%
  • QFN 5x5 sq. mm package
  • Protections:Input Undervoltage Lockout (ViUVLO), Output Under voltage Lockout (VoUVLO),Overcurrent Protection(OCP), Output Overvoltage Protection (OVP), Over temperature Protection (OTP), Short-circuit Protection (SCP)
  • Easy to change any voltage, currents or sequencing (if required) including enable/disable rails using web-basedWebAmp R.D software
  • Power-good flag output and Enable input
  • IC junction temperature range –40°C to +125°C
  • Integrated design lending small PCB footprint
  • Reference design rails meet or exceed Xilinx power performance requirements

Typische Anwendungen

  • Signal processing/Motor control, Low-cost ultrasound, Machine vision/Smart vision, Surveillance/Reconnaissance
  • Networking
  • Traffic engineering/Flight navigation, Secure solutions
  • Cloud computing/Data center, Video processing, Human machine interface

Weiterführende Informationen

Artikeldaten

Artikel Nr.
Daten­blatt
Simu­lation
Downloads
Status
Produktserie
C
Tol. C
VR(V (DC))
Bauform
Betriebstemperatur
DF(%)
RISO
Keramiktyp
L(mm)
B(mm)
H(mm)
Fl(mm)
Verpackung
L(µH)
IRP,40K(A)
RDC max.(mΩ)
fres(MHz)
Version
Muster
WCAP-CSGP MLCCs 25 V(DC), 100 nF, ±20%
Simu­lation
Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.
Kapazität100 nF
Kapazität±20% 
Nennspannung25 V (DC)
Bauform0402 
Betriebstemperatur -55 °C up to +85 °C
Verlustfaktor10 %
Isolationswiderstand5 GΩ
KeramiktypX5R Klasse II 
Länge1 mm
Breite0.5 mm
Höhe0.5 mm
Pad Dimension0.25 mm
Verpackung7" Tape & Reel 
WCAP-CSGP MLCCs 25 V(DC), 10 µF, ±20%
Simu­lation
Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.
Kapazität10 µF
Kapazität±20% 
Nennspannung25 V (DC)
Bauform1206 
Betriebstemperatur -55 °C up to +85 °C
Verlustfaktor10 %
Isolationswiderstand0.01 GΩ
KeramiktypX5R Klasse II 
Länge3.2 mm
Breite1.6 mm
Höhe1.6 mm
Pad Dimension0.6 mm
Verpackung7" Tape & Reel 
WCAP-CSGP MLCCs 6.3 V(DC), 47 µF, ±20%
Simu­lation
Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.
Kapazität47 µF
Kapazität±20% 
Nennspannung6.3 V (DC)
Bauform0805 
Betriebstemperatur -55 °C up to +85 °C
Verlustfaktor10 %
Isolationswiderstand0.002 GΩ
KeramiktypX5R Klasse II 
Länge2 mm
Breite1.25 mm
Höhe1.25 mm
Pad Dimension0.5 mm
Verpackung7" Tape & Reel 
WE-PD SMT-Speicherdrossel, –, –
Simu­lation
Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.
Bauform7345 
Betriebstemperatur -40 °C up to +125 °C
Länge7.3 mm
Breite7.3 mm
Höhe4.5 mm
Induktivität1.5 µH
Performance Nennstrom6.4 A
Gleichstromwiderstand18 mΩ
Eigenresonanzfrequenz75 MHz
VersionRobust