IC-Hersteller AnDAPT Inc
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Details
| Topologie | Abwärtswandler |
| Eingangsspannung | 12 V |
| Ausgang 1 | 0.75 V / 3 A |
| IC-Revision | 1 |
Beschreibung
The AmP™ device is an FPGA based platform for creating a custom Power Management Integrated Circuit (PMIC). The AmP device is customized by adding available Power Components designs based on system requirements. AmP device customization is as easy as using WebAmp™ application software to produce a customized PMIC in a very short period of time. AmP devices can be used to power FPGAs, Processors, Microcontrollers, and ASICs by integrating multiple power rails into single chip designs. The AmP device input voltage range is 4.5V to 20V. The AmP device is targeted for wall-powered applications or 2S-4S Li-Ion battery packs. AmP devices have up to 4 additional integrated LDOs of which two are fixed output voltages (3.3V and 1.2V) and two are user programmable.
Eigenschaften
- AmPMIC enables programmable custom PMIC
- Integrate application targeted Power Components
- Power Blocks for a variety of topologies
- Scalable Integrated N-channel MOSFETs (SIM)
- Current sense for protection, telemetry, regulation
- Build Switching topologies - Buck, Boost, Buck-Boost
- Build Linear topologies - LDO, Load Switch
- Analog fabric connectivity for sensor signals
- Digital μLogic fabric connectivity: Analog/Digital Blocks
- Industry first: Analog Proficiency - Digital Flexibility
Typische Anwendungen
- Power Component Integrator, Digital power management IC
Weiterführende Informationen
Artikeldaten
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR(V (DC)) | Bauform | Betriebstemperatur | DF(%) | RISO | Keramiktyp | L(mm) | B(mm) | H(mm) | Fl(mm) | Verpackung | L(µH) | IRP,40K(A) | ISAT,30%(A) | RDC typ.(mΩ) | RDC max.(mΩ) | fres(MHz) | Montageart | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WCAP-CSGP MLCCs 50 V(DC), 100 nF, ±10% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | Kapazität100 nF | Kapazität±10% | Nennspannung50 V (DC) | Bauform0805 | Betriebstemperatur -55 °C up to +125 °C | Verlustfaktor2.5 % | Isolationswiderstand5 GΩ | KeramiktypX7R Klasse II | Länge2 mm | Breite1.25 mm | Höhe0.8 mm | Pad Dimension0.5 mm | Verpackung13" Tape & Reel | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 100 V(DC), 10 µF, ±10% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 100 V(DC) | Kapazität10 µF | Kapazität±10% | Nennspannung100 V (DC) | Bauform2220 | Betriebstemperatur -55 °C up to +125 °C | Verlustfaktor2.5 % | Isolationswiderstand0.01 GΩ | KeramiktypX7R Klasse II | Länge5.7 mm | Breite5 mm | Höhe2.8 mm | Pad Dimension0.85 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | |||||
 | WE-XHMI SMT Speicherdrossel, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWE-XHMI SMT Speicherdrossel | – | – | – | Bauform6030 | Betriebstemperatur -40 °C up to +125 °C | – | – | – | Länge6.65 mm | Breite6.45 mm | Höhe3 mm | – | – | Induktivität0.56 µH | Performance Nennstrom22.75 A | Sättigungsstrom @ 30%30.8 A | Gleichstromwiderstand2.9 mΩ | Gleichstromwiderstand3.19 mΩ | Eigenresonanzfrequenz77 MHz | MontageartSMT |