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Details
| Topologie | Sonstige Topologie |
Beschreibung
When connected to a specified Analog Devices high speed converter evaluation board, the ADS9-V2EBZ works as a data capture/transmit board. Designed to support the highest speed JESD204B/C data converters, the FPGA on the ADS9-V2EBZ acts as the data receiver for high speed ADC's, and as the transmitter for high speed DAC's.
Eigenschaften
- Xilinx Kintex Ultrascale+ XCKU15P-2FFVE1517E FPGA
- One (1) FMC+ connector.
- Twenty (20) 28Gbps transceivers supported by one (1) FMC+ connector.
- HMC DRAM
- Simple USB 3.0 port interface.
- Two micro SD cards are included, "TRX" -- for ADRV9026 evaluation boards and "HSX" -- for MxFE™ evaluation boards.
Weiterführende Informationen
Artikeldaten
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR(V (DC)) | Bauform | Betriebstemperatur | DF(%) | RISO | Keramiktyp | L(mm) | B(mm) | H(mm) | Fl(mm) | Verpackung | Interface typ | Typ | Gender | Pins | Montageart | Leiterplattendicke(mm) | IR(A) | Arbeitsspannung(V (AC)) | Kanäle | Polarität | VCh max.(V) | ICh Leak max.(µA) | VBR min.(V) | CCh typ.(pF) | IPeak(A) | VCh Clamp ESD typ.(V) | VESD Contact(kV) | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WCAP-CSGP MLCCs 25 V(DC), 1 µF, ±10% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 25 V(DC) | Kapazität1 µF | Kapazität±10% | Nennspannung25 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | Verlustfaktor10 % | Isolationswiderstand0.5 GΩ | KeramiktypX7R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | |||||
 | WE-TVS TVS Diode – High Speed Series, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWE-TVS TVS Diode – High Speed Series | – | – | – | BauformSOT23-6L | Betriebstemperatur -55 °C up to +125 °C | – | – | – | Länge2.9 mm | Breite2.8 mm | Höhe1.16 mm | – | – | – | – | – | – | MontageartSMT | – | – | – | Kanäle2+1 | PolaritätUnidirectional | Kanal Betriebsspannung [max.]5 V | Kanal (Rück) Leckstrom [max.]1 µA | (Rückwärts-) Durchbruchspannung [min.]6 V | (Kanal) Eingangskapazität [typ.]2 pF | (Reverse) Peak Pulse Current7 A | Kanal ESD Klemmspannung [typ.]10 V | ESD Kontact-Entladungsfähigkeit8 kV | ||||
 | WR-USB Standard Connectors, –, – | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWR-USB Standard Connectors | – | – | – | – | Betriebstemperatur -20 °C up to +85 °C | – | Isolationswiderstand100 MΩ | – | – | – | – | – | VerpackungTray | Interface typType B | TypHorizontal | GenderBuchse | Pins9 | MontageartTHT | Leiterplattendicke1.6 mm | Nennstrom1.8 A | Arbeitsspannung30 V (AC) | – | – | – | – | – | – | – | – | – |