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WE-TTT Thermal Transfer Tape

Characteristics

  • Customizable in size and shape
  • No MOQ or tooling costs
  • No need for additional mechanical fixing of cooling assemblies
  • Double-sided adhesive surface
  • High mechanical strength
  • Ideal if a thin bond is required
  • Do you wish an individual offer for WE-TTT? Request now! Request for customized components WE-TTT

Applications

  • Power semiconductors
  • Graphic processing units
  • Microprocessors
  • Chipsets
  • Memory modules
  • Cooling assemblies

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