IC manufacturers NXP

IC manufacturers (103)

NXP LX2160A-RDB-B

Fully qualified to meet NXP quality and reliability requirements. Available for production quantity orders.

Overview

TopologyOther Topology
IC revision00

Description

The LX2160A reference design board provides a comprehensive platform that enables design and evaluation of the LX2160A or LX2162A processors. It comes preloaded with a board support package (BSP) based on a standard Linux kernel.Enables network intelligence with the next generation Datapath (DPPA2) which provides differentiated offload and a rich set of IO, including 10GE, 25GE, 40GE, and PCIe Gen3Delivers unprecedented efficiency and new virtualized networksSupports designs in 5G packet processing, network function virtualization, storage controller, white box switching, network interface cards, and mobile edge computingSupports all six LX2 family members (16-core LX2160A and LX2161A; 12-core LX2120A and LX2122A; and 8-core LX2080A and LX2082A)

Features

  • Processor:
  • LX2160A, 16x Arm® Cortex®-A72 CPU, 2.2GHz
  • Memory:
  • Two DDR4 UDIMM to 3200MT/s
  • 32GB total capacity (16GB per UDIMM)
  • Flash: 128MB NOR, 128GB eMMC
  • Ethernet:
  • One 40G Ethernet QSFP+
  • Two 25G Ethernet SFP+
  • Two RJ45 10G Ethernet
  • Two RJ45 1G Ethernet
  • Other IO:
  • One PCIe Gen3 x8 slot
  • One PCIe Gen3 x4 slot
  • Four SATA3.0 connectors
  • One USB3.0 Type A connector
  • One USB3.0 micro-AB connector

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
C
Tol. C
VR(V (DC))
Size
Operating Temperature
Q(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
L(µH)
IRP,40K(A)
ISAT(A)
RDC max.(mΩ)
fres(MHz)
Version
LR(nH)
IR(A)
ISAT,10%(A)
ISAT,30%(A)
RDC(mΩ)
Material
Pins
Gender
Type
Variant
Mount
Durability
Samples
SPEC
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance22 pF
Capacitance±5% 
Rated Voltage50 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Q-Factor840 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
SPEC
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size1050 
Operating Temperature -40 °C up to +150 °C
Length10 mm
Width10 mm
Height5 mm
Inductance1.5 µH
Saturation Current12.5 A
DC Resistance6.6 mΩ
Self Resonant Frequency69 MHz
VersionPerformance 
Rated Current10 A
Pins
MountSMT 
SPEC
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size1070 
Operating Temperature -40 °C up to +125 °C
Length10.1 mm
Width7 mm
Height6.8 mm
Pad Dimension2.6 mm
Inductance0.33 µH
Performance Rated Current54.3 A
Self Resonant Frequency35 MHz
Rated Inductance305 nH
Rated Current25 A
Saturation Current @ 10%27.3 A
Saturation Current @ 30%32 A
DC Resistance0.37 mΩ
MaterialMnZn 
Pins
MountSMT 
SPEC
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -25 °C up to +85 °C
Insulation Resistance1000 MΩ
PackagingTape and Reel 
Rated Current0.5 A
Pins
GenderSocket 
TypePush & Push 
Variantwith Card Detection 
MountSMT 
Durability10 000 Mating cycles