IC-Hersteller EPC
IC-Hersteller (96)
- Alle Hersteller
Analog Devices
Infineon Technologies
Maxim Integrated
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (12)
- Ablic (23)
- Advanced Power (4)
- Allegro Microsystems (83)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (130)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Broadcom (47)
- Cambridge GaN Devices (16)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Dialog Semiconductor (11)
- Diodes Incorporated (219)
- Divimath (8)
- Elmos AG (1)
- EPC (98)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (6)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- Ikanos (3)
- IKON (1)
- Indie Semiconductor (1)
- Innovision Semiconductor Inc (2)
- Intel (80)
- Inventchip Technology (3)
- ISSI (34)
- JoulWatt (20)
- KDPOF (2)
- Kinetic Technology (9)
- Lattice semiconductor Corporation (8)
- Littelfuse (1)
- M3 Technology (M3Tek) (4)
- Macnica (16)
- MaxLinear (175)
- MikroE (7)
- MindCet (1)
- Monolithic Power Systems (879)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (2)
- Nisshinbo Micro Device Inc. (10)
- Nordic Semiconductor (1)
- Novosense Micro (1)
- NXP (312)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (96)
- Pulsiv (18)
- Qorvo (87)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (289)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (90)
- SG-Micro (19)
- Silanna Semiconductor (8)
- Silergy Corporation (29)
- Silicon Laboratory Inc. (90)
- Silicontent Technology (56)
- Silvertel (54)
- Skyworks (31)
- Southchip (6)
- Summit Wireless (1)
- Tagore Tech (4)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (1)
- Valens Semiconductor (18)
- Wise Integration (1)
- Wolfspeed (5)
- Xilinx (18)
- XL Semiconductor (3)
- XYSemi (62)
Details
| Topologie | SEPIC Buck-Boost Topologie |
| Schaltfrequenz | 6102-7458 kHz |
| IC-Revision | 3.2 |
Beschreibung
The EPC9114 is a complete demonstration kit for a Class 2, ZVS Class-D wireless power system capable of delivering up to 10 W output power and operating at 6.78 MHz.
Eigenschaften
The EPC9114 wireless power system comprises three boards:
- A Source Board (Transmitter or Power Amplifier) EPC9510
- A Class 2 A4WP compatible Source Coil (Transmit Coil)
- A Category 3 A4WP compatible Device Coil with rectifier and DC smoothing capacitor.
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Produktserie | Raster (mm) | Montageart | IR 1 (A) | Arbeitsspannung (V (AC)) | PCB/Kabel/Panel | Kontaktwiderstand (mΩ) | Tol. R | L (mm) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q (%) | DF (%) | RISO | Keramiktyp | W (mm) | Fl (mm) | L (nH) | Tol. L | Testbedingung L | Qmin. | Testbedingung Q | RDC max. (mΩ) | fres (GHz) | Pins | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 61300111121 | SPEC | – | 6 Dateien | WR-PHD 2.54 mm THT Pin Header | 2.54 | THT | – | 250 | – | 20 | max. | 2.54 | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | – | – | – | – | – | – | – | – | – | 1 | Single | – | Pin Header | Gerade | 3 | Beutel | |
| 61300211121 | SPEC | – | 6 Dateien | WR-PHD 2.54 mm THT Pin Header | 2.54 | THT | – | 250 | – | 20 | max. | 5.08 | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | – | – | – | – | – | – | – | – | – | 2 | Single | – | Pin Header | Gerade | 3 | Beutel | |
 | 645002114822 | SPEC | – | 6 Dateien | WR-WTB 3.96 mm Male Vertical Locking Header | 3.96 | THT | 7 | 250 | PCB | 20 | max. | 7.92 | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | – | – | – | – | – | – | – | – | – | 2 | – | – | Männlich | Vertikal | 7 | Beutel | |
 | 744912182 | SPEC | 9 Dateien | WE-CAIR Luftspulen | – | SMT | – | – | – | – | – | 4.83 | – | – | – | 4248 | -40 °C up to +125 °C | – | – | – | – | 3.81 | – | 82 | ±5% | 150 MHz | 100 | 150 MHz | 9.4 | 1.3 | – | – | 4.2 | – | – | 2.5 | – | ||
 | 885012005057 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 1 | 22 pF | ±5% | 50 | 0402 | -55 °C up to +125 °C | 840 | – | 10 GΩ | NP0 Klasse I | 0.5 | 0.25 | – | – | – | – | – | – | – | – | – | 0.5 | – | – | – | 7" Tape & Reel | ||
| 885012205037 | SPEC | 5 Dateien | WCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | 1 | 100 nF | ±10% | 16 | 0402 | -55 °C up to +125 °C | – | 5 | 5 GΩ | X7R Klasse II | 0.5 | 0.25 | – | – | – | – | – | – | – | – | – | 0.5 | – | – | – | 7" Tape & Reel | ||
| 885012205052 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | 1 | 22 nF | ±10% | 25 | 0402 | -55 °C up to +125 °C | – | 3.5 | 10 GΩ | X7R Klasse II | 0.5 | 0.25 | – | – | – | – | – | – | – | – | – | 0.5 | – | – | – | 7" Tape & Reel | ||
| 885012206076 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | 1.6 | 1 µF | ±10% | 25 | 0603 | -55 °C up to +125 °C | – | 10 | 0.5 GΩ | X7R Klasse II | 0.8 | 0.4 | – | – | – | – | – | – | – | – | – | 0.8 | – | – | – | 7" Tape & Reel | ||
| 885012207103 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 2 | 1 µF | ±10% | 50 | 0805 | -55 °C up to +125 °C | – | 10 | 0.1 GΩ | X7R Klasse II | 1.25 | 0.5 | – | – | – | – | – | – | – | – | – | 1.25 | – | – | – | 7" Tape & Reel |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 61300111121 | SPEC | – |
| 61300211121 | SPEC | – |
| 645002114822 | SPEC | – |
| 744912182 | SPEC | |
| 885012005057 | SPEC | |
| 885012205037 | SPEC | |
| 885012205052 | SPEC | |
| 885012206076 | SPEC | |
| 885012207103 | SPEC |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Produktserie | Raster (mm) | Montageart | IR 1 (A) | Arbeitsspannung (V (AC)) | PCB/Kabel/Panel | Kontaktwiderstand (mΩ) | Tol. R | L (mm) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q (%) | DF (%) | RISO | Keramiktyp | W (mm) | Fl (mm) | L (nH) | Tol. L | Testbedingung L | Qmin. | Testbedingung Q | RDC max. (mΩ) | fres (GHz) | Pins | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster |
|---|