Electronic & electromechanical components

Passive Components

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EMC Components Power Magnetics Signal & Communications Capacitors Resistors Quartz Crystals & Oscillatorsmore

Active Components

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Power Modules (MagI³C Series)Digital Isolators Sensors Radio Modulesmore

Electromechanical Components

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Connectors Switches Assembly REDCUBE Terminalsmore

Optoelectronic Components

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LEDs IC LEDs Infrared Ultraviolet Optocoupler Laser 7 Segments Display Optical Sensors Development Kits Evaluation Kitsmore

Thermal Management

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Gap Filling Solutions Heat Spreading Solutions Hybrid Solutions Heat Sinks Sample Kits Thermal Managementmore

Automotive

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Ferrites for Cable Assembly Ferrites for PCB Assembly Filter Chokes Common Mode Chokes for Mains Power Lines Common Mode Chokes for Extra-low Voltage and Data Lines Single Coil Power Inductors Power Transformer RF Inductors Assembly REDCUBE PRESS FIT Terminals Customized Solutions Design Kits Automotive Alpha-Rack Automotivemore

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GRINN – GenioBoard Edge AI SBCmore

All new productsEMC ComponentsSignal & CommunicationsCapacitorsSensorsRadio ModulesConnectorsSwitchesOptocouplerCommon Mode Chokes for Mains Power LinesSingle Coil Power Inductors

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- Conductive EMC seal with textile shielding
- Halogen-free in accordance with IEC-61249-2-21, with IP54 protection and UL94 V0
- Customizable in profile, length, adhesive and outer material

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- New 5G absorber sheet for frequencies from 410 MHz to 7125 MHz
- Fully customizable (dimensions, adhesives, shapes, packaging, etc.)
- Ideal for high frequency applications, EMC noise supression, SAR reduction and EMC shielding

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- Extremely flexible and thin nanocrystalline sheets for low frequency (LF) magnetic field applications
- Easy placement and handling thanks to standard adhesive backing
- High surface resistance and easy to process

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- Test voltage of 2250 VDC / 1 min.
- Available in various footprints
- Operating temperature: -40 °C to 125 °C

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- Y2/X1 capacitors for safety and EMI suppression
- Good self-healing properties
- Ideal for safety applications, main filters and between line/neutral and ground

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- Flexible interface options: I²C, SPI, and analog outputs, plus an integrated CRC check for reliable data integrity.

- High precision: Operating voltage range of 3–5.5 V and 16‑bit ADC/DAC enabling accurate differential pressure measurements.

- Wide application range: Five fixed pressure ranges from ±1 kPa to –100…1000 kPa, suitable for diverse use cases.

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- Bluetooth® LE 6.0 with nRF54L15 and 1.5 MB NVM / 256 kB RAM.
- Smart antenna: integrated PCB antenna or external antenna option.
- Compact & efficient: 12×8×2.3 mm, +8 dBm output power, 0.6 µA system‑off current.

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- Rapid prototyping: Enables quick and effortless testing of the Daphnis‑I module within the Adafruit Feather ecosystem.

- Easy onboarding: Example code for LoRaWAN and P2P, plus an online user manual, support a fast and smooth start.

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- Optimized proprietary mesh module: Uses the WE‑ProWare protocol offering high flexibility — either up to 400 kbps data rate or up to 2.7 km range at 868 MHz.
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Compact & energy‑efficient: 12 × 8 × 2 mm, 14 dBm output power, UART communication; ideal for large mesh networks.

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- Flexible development platform: Built on the Nordic nRF54L15 SoC, Ophelia‑IV serves as a customizable platform for firmware development using the nRF Connect SDK and Zephyr RTOS.
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Extensive protocol support: Depending on the firmware, it supports modern wireless standards such as Thread, Zigbee, Matter, and IEEE 802.15.4, along with Smart Antenna Selection.

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- Full firmware freedom: A “build‑your‑own‑firmware” module based on the TI CC1310, enabling custom protocol development via the TI SimpleLink CC13x0 SDK.
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Wide protocol support: Supports Wireless M‑Bus, IEEE 802.15.4g, MIOTY, 6LoWPAN, with 14 dBm TX power and UART/SPI interfaces.

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- SKEDD direct plug-in technology
- Active locking with acoustic & haptic feedback
- Mechanical stability up to 10 g

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Manual crimp tool for the new WR-WSP SKEDD terminal

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- Low profile WTB solution with 0.8 mm pitch
- Pre-assembled cable solution
- Electrical specification: 30 V / 1 A

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- High current (6.5 A) and high Voltage (250 V)
- Space saving design
- Glow Wire tested

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- Standard and low-force crimp contacts
- AWG 26-24 & AWG 22-20
- Single contacts for manual prototyping

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- Cables with standard and low-force contacts
- 150 mm & 300 mm cable length
- Ideal for prototyping

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- Suitable for single-crimpcontacts of WR-NPC2 series
- Separate crimp head available for existing handles
- Covers all secified AWG range of WR-NPC2

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- Suitable for reeled crimpcontacts of WR-NPC2 series
- Fits in a wide range of semi-automatic crimp-tools
- Covers all secified AWG range of WR-NPC2

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- Designed to RAST standard
- Glow-Wire compliant
- Wide range of coding available

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- Screwless cable connection
- Optionally with/without flange or with locking lever
- Electrical specification: 300 V / 8 A

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- Pluggable THT Terminal Block
- Horizontal, vertical, with or without flange
- Electrical specification: 150 V/ 300 V / 8 A

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- Suitable for reflow soldering process
- Horizontal, vertical, with or without flange
- Electrical specification: 150 V / 300 V / 8 A

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- Schematic: SPDT or DPDT
- Switching Function: ON-OFF-ON or ON-ON
- Electrical lifecycle: 10.000 cycles

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- Combination of an AlgaAs infrared LED with a silicon phototransistor
- Isolation voltage of 3750 VRMS
- Ideal for switched-mode power supplies, PLCs, household appliances, and galvanic isolation

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- Very high permeability nanocrystalline core material
- Improved isolation through plastic case and winding spacer
- Automotive qualified

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- High‑voltage MnZn common mode choke for automotive use up to 1000 VAC / 1250 VDC and 22 A
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Reinforced isolation with plastic case and spacer

- Ideal for power line filtering and common‑mode noise suppression in DC/DC converters, onboard chargers, and motor inverters

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- Innovative iron alloy material
- Ultra low RDC and AC losses
- Automotive qualified

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Electronics Manufacturing

Vapor Phase Soldering

Discover how our electromechanical components, in collaboration with IBL soldering technology, not only provide comfort and safety but also demonstrate excellence under extreme conditions in the vapor phase soldering process.

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Power Electronics

Thermal Management

Thermal management describes the dissipation and distribution of heat in an application to avoid overheating and extend the lifespan of the installed electronic components.

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Internet of Things

Wireless Connectivity and Sensors

Internet of Things describes the exchange of data in a network of physical and virtual objects, enabling collaboration between them. Wireless modules and sensors provide the foundation for this.

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Data Transmission

Single Pair Ethernet

Single Pair Ethernet represents a new type of data transmission. Unlike multipair Ethernet, it only requires two wires. The reduced number of wires results in thinner cable diameters and lower costs.

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Electronic & electromechanical components

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