Wolfspeed C2M1000170J | Demoboard CRD-15DD17P

Description

Thermal design is an important consideration for power devices. With a trend to push power levels, power density, and efficiency higher in power converters, surface-mount power switches are gaining popularity due to their small form factor and ease of manufacturing. This application note discusses important design considerations for the thermal design of Wolfspeed’s discrete bottom-side cooled device portfolio to extract the best performance out of these devices. It will discuss the importance of selecting the right device package and following the recommended soldering profile, Printed Circuit Board (PCB) design, thermal interface material, and heatsink mounting. The PCB thermal impedance plays a critical role in bottom-side cooled devices, so it is important to consider the thermal impedance when optimizing footprint and the number of vias required, which also impact the cost.

Features

• High Blocking Voltage
• High Creepage Distance(~7mm)
• Low Source Inductance due to KeLvin Source availability
• Low RDS(on) Change over Temperature
• High Frequency Operation

Typical applications

• motor drives; solar power; traction
• Energy Storage

More information

• Datasheet
• IC product information