IC manufacturers Transphorm

IC manufacturers (103)

Transphorm TP65H050 | Demoboard TDTTP3300-RD

TDTTP3300-RD 3.3kW Bridgeless Totem-pole PFC

Overview

TopologyPower Factor Correction
Input voltage85-265 V
Output 1397 V
IC revision1.1

Description

The TDTTP3300-RD 3.3kW bridgeless totem-pole PFC reference design provides an excellent platform for evaluating the performance of Transphorm’s GaN FETs and a starting point for designing a high-efficiency DSP-based PFC converter. This DSP firmware-based totem-pole PFC gives power hardware designers a fully functional design solution with no digital code expertise required, reducing design time and accelerating time to market.

Features

  • DSP firmware-based state-machine for fully-functional PFC converter
  • Facilitates DSP-based design without code expertise
  • User-defined operational parameters, e.g., VOUT, switching frequency, soft-start, fault limits, etc.

Typical applications

  • Datacom
  • Servo motor
  • PV inverter
  • Broad industrial

More information

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
C
Tol. C
VR(V (DC))
Size
Operating Temperature
Q(%)
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
Samples
WCAP-CSGP MLCCs 25 V(DC), 33 pF, ±5%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance33 pF
Capacitance±5% 
Rated Voltage25 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 25 V(DC), 100 pF, ±5%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 pF
Capacitance±5% 
Rated Voltage25 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Q-Factor1000 %
Insulation Resistance10 GΩ
Ceramic TypeNP0 Class I 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 50 V(DC), 330 pF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance330 pF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 10 V(DC), 3.3 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance3.3 nF
Capacitance±10% 
Rated Voltage10 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 50 V(DC), 100 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 25 V(DC), 2.2 µF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 µF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.05 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Height1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel