| Topology | Other Topology |
| IC revision | A |
This reference design showcases a Type-3, 30W, 2-Pair 24-port Ethernet switch for Power over Ethernet (PoE) applications which can send up to 30W per port for IEEE 802.3bt Type 3 applications and up to 60W per port for non-standard applications. Based on the MSP430F523x family, TI's TPS2388x FirmPSE system firmware provides a total system level solution for multi-port applications which reduces time to market and frees-up valuable software resources. This design supports port power management with priority, multiple power supplies, legacy PD detection, field upgradability, UART/I2C communication with the host, and more. TI’s FirmPSE system firmware GUI for this design enables the customization of production level PSE system firmware code with just a few clicks of a button and provides real-time communication to the system. In addition, two of these designs may be cascaded through the edge connectors in order to support up to 48-port PSE systems.
Order Code | Datasheet | Simulation | Downloads | Status | Product series | C | Tol. C | VR(V (DC)) | Size | Operating Temperature | DF(%) | RISO | Ceramic Type | L(mm) | W(mm) | H(mm) | Fl(mm) | Packaging | L(µH) | IR(A) | ISAT(A) | fres(MHz) | Mount | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WCAP-CSGP MLCCs 16 V(DC), 10 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 16 V(DC) | Capacitance10 nF | Capacitance±10% | Rated Voltage16 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Dissipation Factor3.5 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), 10 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 50 V(DC) | Capacitance10 nF | Capacitance±10% | Rated Voltage50 V (DC) | Size0603 | Operating Temperature -55 °C up to +125 °C | Dissipation Factor2.5 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1.6 mm | Width0.8 mm | Height0.8 mm | Pad Dimension0.4 mm | Packaging7" Tape & Reel | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), 100 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 50 V(DC) | Capacitance100 nF | Capacitance±10% | Rated Voltage50 V (DC) | Size0603 | Operating Temperature -55 °C up to +125 °C | Dissipation Factor3 % | Insulation Resistance5 GΩ | Ceramic TypeX7R Class II | Length1.6 mm | Width0.8 mm | Height0.8 mm | Pad Dimension0.4 mm | Packaging7" Tape & Reel | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 10 V(DC), 10 µF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 10 V(DC) | Capacitance10 µF | Capacitance±10% | Rated Voltage10 V (DC) | Size0805 | Operating Temperature -55 °C up to +125 °C | Dissipation Factor10 % | Insulation Resistance0.01 GΩ | Ceramic TypeX7R Class II | Length2 mm | Width1.25 mm | Height1.25 mm | Pad Dimension0.5 mm | Packaging7" Tape & Reel | – | – | – | – | – | |||||
![]() | WE-TPC SMT Tiny Power Inductor, –, – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWE-TPC SMT Tiny Power Inductor | – | – | – | Size6823 | Operating Temperature -40 °C up to +125 °C | – | – | – | Length6.8 mm | Width6.8 mm | Height2.3 mm | – | – | Inductance150 µH | Rated Current0.43 A | Saturation Current0.36 A | Self Resonant Frequency9 MHz | MountSMT |