| Topology | Other Topology |
| IC revision | A |
The SimpleLink MSP432E401Y Arm® Cortex®-M4F microcontrollers provide top performance and advanced integration. The product family is positioned for cost-effective applications requiring significant control processing and connectivity capabilities.The MSP432E401Y microcontrollers integrate a large variety of rich communication features to enable a new class of highly connected designs with the ability to allow critical real-time control between performance and power. The microcontrollers feature integrated communication peripherals along with other high-performance analog and digital functions to offer a strong foundation for many different target uses, spanning from human-machine interface (HMI) to networked system management controllers.In addition, the MSP432E401Y microcontrollers offer the advantages of widely available development tools, system-on-chip (SoC) infrastructure, and a large user community for Arm-based microcontrollers. Additionally, these microcontrollers use the Arm Thumb®-compatible Thumb-2® instruction set to reduce memory requirements and, thereby, cost. When using the SimpleLink MSP432™ SDK, the MSP432E401Y microcontroller is code compatible with all members of the extensive SimpleLink family, providing flexibility to fit precise needs.The MSP432E401Y device is part of the SimpleLink microcontroller (MCU) platform, which consists of Wi-Fi®, Bluetooth® low energy, Sub-1 GHz, Ethernet, Zigbee, Thread, and host MCUs, which all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit www.ti.com/simplelink.
Order Code | Datasheet | Simulation | Downloads | Status | Product series | C | Tol. C | VR(V (DC)) | Size | Operating Temperature | DF(%) | RISO | Ceramic Type | L(mm) | W(mm) | H(mm) | Fl(mm) | Packaging | Samples |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WCAP-CSGP MLCCs 25 V(DC), 10 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 25 V(DC) | Capacitance10 nF | Capacitance±10% | Rated Voltage25 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Dissipation Factor3.5 % | Insulation Resistance10 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | ||||
| WCAP-CSGP MLCCs 10 V(DC), 100 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 10 V(DC) | Capacitance100 nF | Capacitance±10% | Rated Voltage10 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Dissipation Factor5 % | Insulation Resistance5 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | ||||
| WCAP-CSGP MLCCs 10 V(DC), 1 µF, ±20% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 10 V(DC) | Capacitance1 µF | Capacitance±20% | Rated Voltage10 V (DC) | Size0402 | Operating Temperature -55 °C up to +85 °C | Dissipation Factor15 % | Insulation Resistance0.05 GΩ | Ceramic TypeX5R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel |