IC manufacturers Texas Instruments

IC manufacturers (103)

Texas Instruments MSP430F5234IRGZR | Demoboard TIDA-050026-23881

24-port (PoE 2, 2-pair) power sourcing equipment reference design for multi-port applications

Overview

TopologyOther Topology
IC revisionA

Description

This reference design showcases a Type-4, 90W, 4-Pair 24-port Ethernet switch for Power over Ethernet (PoE) applications which can send up to 90W per port for IEEE 802.3bt Type 4 applications and up to 120W per port for non-standard applications. Based on the MSP430F523x family, TI's TPS2388x FirmPSE system firmware provides a total system level solution for multi-port applications which reduces time to market and frees-up valuable software resources. This design supports port power management with priority, multiple power supplies, legacy PD detection, field upgradability, UART/I2C communication with the host, and more. TI’s FirmPSE system firmware GUI for this design enables the customization of production level PSE system firmware code with just a few clicks of a button and provides real-time communication to the system. In addition, two of these designs may be cascaded through the edge connectors in order to support up to 48-port PSE systems.

Features

  • Configurable GUI and host interface
  • Multi-port power management
  • Ability to cascade two designs through edge connectors to enable 48-port PSE system
  • Supports multiple power supplies
  • Legacy PD capacitance measurement

Typical applications

  • Campus and branch switches, Edge router
  • Video recorder

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
C
Tol. C
VR(V (DC))
Size
Operating Temperature
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
Samples
WCAP-CSGP MLCCs 50 V(DC), 1 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 16 V(DC), 100 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 10 V(DC), 10 µF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance10 µF
Capacitance±10% 
Rated Voltage10 V (DC)
Size0805 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.01 GΩ
Ceramic TypeX7R Class II 
Length2 mm
Width1.25 mm
Height1.25 mm
Pad Dimension0.5 mm
Packaging7" Tape & Reel