IC manufacturers Texas Instruments

IC manufacturers (103)

Texas Instruments LMX2695 | Demoboard LMX2695SEPEVM

https://www.ti.com/tool/LMX2695SEPEVM

Overview

TopologyRF signals / communications
IC revisionA

Description

The LMX2695SEPEVM is used to evaluate the performance of the LMX2695-SEP device. This device is a radiation-hardened RF synthesizer in 10mm × 10mm 64-pin plastic package. This device is able to generate continuous wave signals up to 28GHz. The evaluation module provides all the hardware interface to enable users to quickly evaluate and develop with this RF synthesizer.

Features

Up to 15GHz direct VCO output and 28GHz VCO doubler output at both output portsJESD204 SYSREF clock generation and repeater mode operationSupport synchronization of output phase across multiple devicesOnboard USB interface for SPI controlSupport pin control operation without SPI programming

Typical applications

More information

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
C
Tol. C
VR(V (DC))
Size
Operating Temperature
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
Samples
WCAP-CSGP MLCCs 16 V(DC), 2.2 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 50 V(DC), 3.3 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance3.3 nF
Capacitance±10% 
Rated Voltage50 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor2.5 %
Insulation Resistance10 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 25 V(DC), 68 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance68 nF
Capacitance±10% 
Rated Voltage25 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance7.4 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 16 V(DC), 100 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor3.5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 16 V(DC), 1 µF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.1 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WCAP-CSGP MLCCs 16 V(DC), 2.2 µF, ±20%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance2.2 µF
Capacitance±20% 
Rated Voltage16 V (DC)
Size0603 
Operating Temperature -55 °C up to +85 °C
Dissipation Factor10 %
Insulation Resistance0.05 GΩ
Ceramic TypeX5R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel