| Topology | Other Topology |
| IC revision | E1 |
This reference design demonstrates how to achieve multiple ADC interleaving with high sampling rates and good resolution at low BOM-cost. The reference design was built with electronic imaging systems in mind. High definition imaging and other high speed signal processing applications require ADCs that can achieve high resolution, high SNR, high speed and low power consumption. These requirements cannot always be met with a single chip. By interleaving multiple SAR ADCs, the design optimizes trade-offs between different ADCs in order to meet all of the system requirements.
Order Code | Datasheet | Simulation | Downloads | Status | Product series | C | Tol. C | VR(V (DC)) | Size | Operating Temperature | DF(%) | RISO | Ceramic Type | L(mm) | W(mm) | H(mm) | Fl(mm) | Packaging | Ti | Ø ID(mm) | Ø OD(mm) | Qty. | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WCAP-CSGP MLCCs 16 V(DC), 100 nF, ±10% | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 16 V(DC) | Capacitance100 nF | Capacitance±10% | Rated Voltage16 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Dissipation Factor5 % | Insulation Resistance5 GΩ | Ceramic TypeX7R Class II | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | – | – | – | Packaging Unit10000 | |||||
![]() | WA-SMSI SMT Steel Spacer with internal Thread M3, –, – | Simulation– | Downloads6 files | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWA-SMSI SMT Steel Spacer with internal Thread M3 | – | – | – | – | Operating Temperature -55 °C up to +150 °C | – | – | – | Length5 mm | – | – | – | PackagingTape and Reel | Inner ThreadM3 | Inner Diameter4.2 mm | Outer Diameter6 mm | Packaging Unit650 |