IC manufacturers Texas Instruments

IC manufacturers (103)

Texas Instruments ADS7056IRUGR | Demoboard TIDA-01355

14-bit 2.5-MSPS ultra-low-power ultra-small-size SAR ADC with SPI

Overview

TopologyOther Topology
IC revisionE1

Description

This reference design demonstrates how to achieve multiple ADC interleaving with high sampling rates and good resolution at low BOM-cost. The reference design was built with electronic imaging systems in mind. High definition imaging and other high speed signal processing applications require ADCs that can achieve high resolution, high SNR, high speed and low power consumption. These requirements cannot always be met with a single chip. By interleaving multiple SAR ADCs, the design optimizes trade-offs between different ADCs in order to meet all of the system requirements.

Features

  • Resolution: 14-bit
  • input type: unipolar single-ended
  • SNR > 73dB, ENOB: 12-bit, THD < -80dB
  • Power: < 33mW
  • Low latency compared to pipeline ADC-based solution
  • Small form factor: 22mm x 13mm

Typical applications

  • Motor Controls
  • Fire and Smoke Detection
  • Handheld Radios

Products

Order Code
Data­sheet
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Status
Product series
C
Tol. C
VR(V (DC))
Size
Operating Temperature
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
Ti
Ø ID(mm)
Ø OD(mm)
Qty.
Samples
WCAP-CSGP MLCCs 16 V(DC), 100 nF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance100 nF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0402 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor5 %
Insulation Resistance5 GΩ
Ceramic TypeX7R Class II 
Length1 mm
Width0.5 mm
Height0.5 mm
Pad Dimension0.25 mm
Packaging7" Tape & Reel 
Packaging Unit10000 
WA-SMSI SMT Steel Spacer with internal Thread M3, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Operating Temperature -55 °C up to +150 °C
Length5 mm
PackagingTape and Reel 
Inner ThreadM3 
Inner Diameter4.2 mm
Outer Diameter6 mm
Packaging Unit650