Topology | Other Topology |
IC revision | E1 |
This reference design demonstrates how to achieve multiple ADC interleaving with high sampling rates and good resolution at low BOM-cost. The reference design was built with electronic imaging systems in mind. High definition imaging and other high speed signal processing applications require ADCs that can achieve high resolution, high SNR, high speed and low power consumption. These requirements cannot always be met with a single chip. By interleaving multiple SAR ADCs, the design optimizes trade-offs between different ADCs in order to meet all of the system requirements.
Order Code | Datasheet | Simulation | Downloads | Product series | C | Tol. C | VR (V (DC)) | Size | Operating Temperature | DF (%) | RISO | Ceramic Type | L (mm) | W (mm) | H (mm) | Fl (mm) | Packaging | Ti | Ø ID (mm) | Ø OD (mm) | Qty. (pcs) | Samples | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
885012205037 | SPEC | 5 files | WCAP-CSGP MLCCs 16 V(DC) | 100 nF | ±10% | 16 | 0402 | -55 °C up to +125 °C | 5 | 5 GΩ | X7R Class II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | 10000 | |||
9774050360R | SPEC | – | 6 files | WA-SMSI SMT Steel Spacer with internal Thread M3 | – | – | – | – | -55 °C up to +150 °C | – | – | – | 5 | – | – | – | Tape and Reel | M3 | 4.2 | 6 | 650 |
Order Code | Datasheet | Simulation | |
---|---|---|---|
885012205037 | SPEC | ||
9774050360R | SPEC | – |
Samples |
---|
Order Code | Datasheet | Simulation | Downloads | Product series | C | Tol. C | VR (V (DC)) | Size | Operating Temperature | DF (%) | RISO | Ceramic Type | L (mm) | W (mm) | H (mm) | Fl (mm) | Packaging | Ti | Ø ID (mm) | Ø OD (mm) | Qty. (pcs) | Samples |
---|