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NXP FS6507 | Demoboard KITFS6507LAEEVM
FS6500: Grade 1 and Grade 0 Safety Power System Basis Chip with CAN Flexible Data Transceiver
Overview
| Topology | Other Topology |
| IC revision | A |
Description
KITFS6507LAEEVM evaluation board demonstrates the functionality of MC33FS6507 supports CAN FD and LIN with Vcore SMPS regulator up to 0.8 A.These Safety SBCs target ISO 26262 automotive functional safety standard (ASIL B). NXP’s analog product development boards provide an easy-to-use platform for evaluating NXP products. The boards support a range of analog, mixed-signal and power solutions. They incorporate monolithic ICs and system-in-package devices that use proven high-volume SMARTMOS technology. NXP products offer longer battery life, a smaller form factor, reduced component counts, lower cost and improved performance in powering state of the art systems. The tool can be used in a standalone mode and controlled with an embedded USB interface. SPI command is easily controlled by the FlexGUI downloadable here.
More information
Products
Order Code | Datasheet | Simulation | Downloads | Status | Product series | C | Tol. C | VR(V (DC)) | Size | Operating Temperature | Q | RISO | Ceramic Type | L(mm) | W(mm) | H(mm) | Fl(mm) | Packaging | SamplesAvailability & Sample | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
SPECWCAP-CSGP MLCCs 50 V(DC), 22 pF, ±5% | Availability – | Status Activei| Production is active. Expected lifetime: >10 years. | Product seriesWCAP-CSGP MLCCs 50 V(DC) | Capacitance22 pF | Capacitance±5% | Rated Voltage50 V (DC) | Size0402 | Operating Temperature -55 °C up to +125 °C | Q-Factor840 | Insulation Resistance10 GΩ | Ceramic TypeNP0 Class I | Length1 mm | Width0.5 mm | Height0.5 mm | Pad Dimension0.25 mm | Packaging7" Tape & Reel | –Check availability |
| Expected Availability | Opening inventory | Quantity |
|---|---|---|
| Current Availability | – | – |