GaN Systems GS66516B | Demoboard GSP65RXXHB-EVB

Description

A frequent challenge for power designers is to engineer a product that has excellent power density while simultaneously reducing the cost of the system.This IMS evaluation platform demonstrates an inexpensive way to improve heat transfer, to increase power density and reduce system cost. An Insulated Metal Substrate PCB (IMS PCB) is used to cool GaN Systems’ bottom-side cooled power transistors. An IMS PCB is also known as Metal Core/Aluminum PCB.

Features

• 650 V enhancement mode power transistor -Bottom-side cooled configuration
• RDS(on) = 25 mΩ
• IDS(max) = 60 A
• Ultra-low FOM die
• Low inductance GaNPX® package
• Simple drive requirements (0 V to 6 V)
• Transient tolerant gate drive (-20 V / +10 V) -Very high switching frequency (> 10 MHz)
• Fast and controllable fall and rise times
• Reverse current capability
• Zero reverse recovery loss
• Small 11 x 9 mm2 PCB footprint
• Source Sense (SS) pins for optimized gate drive
• Dual Gate Pins for optimal paralleling
• RoHS 3 (6 + 4) compliant

Typical applications

• Energy Storage Systems, Solar Energy
• On Board Battery Chargers
• Uninterruptible Power Supplies
• AC-DC Converters, DC-DC Converters, Bridgeless Totem Pole PFC, Inverters, Industrial Motor Drives, Laser Drivers, Traction Drive

More information

• Datasheet