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Texas Instruments TPA3255 | Demoboard SIDEGIG-XOVEREVM

Analog Crossover Audio Plug-In Module

Details

TopologieDAC

Beschreibung

The TI Analog Crossover Audio Plug-in Module (SIDEGIG-XOVEREVM) turns TI Audio Class-D amplifier EVM’s into a high quality, two-way speaker amplifier. The plug-in module makes it easy to remove thelarge and expensive passive crossover found in passive loudspeakers and create a bi-amped,two-way system with improved efficiency and reduced size. The board features a tunable active crossover with ahigh-pass filter,low-pass filter,baffle step, and delay to create two audio output signals for a tweeter and woofer. There are many advantages of designing active speakers including well-matched and well-tunedaudio. This audio plug-in module plugs into an analog input Class-D audio evaluation module (EVM) with an audio interface board (AIB) connector. This document provides information including setup,operation, schematics,bill of materials (BOM) and printed-circuit board (PCB) layout.

Eigenschaften

  • Compatible with the TI Audio Plug-in Module Ecosystem
  • Standard RCA input jack
  • Self-powered when connected to an audio Class-D EVM
  • Differential outputs for both high and low channels which can directly drive the audio Class-D EVM
  • Standard banana plug jacks for using an optional, external dual-rail supply for the board
  • Potentiometers for input volume control as well as separate high- and low-channel volume control
  • Fourth-order active high-pass filter
  • Optional fourth-order active low-pass filter
  • Optional baffle-step compensation
  • Optional all-pass filter for delay adjustment
  • Supports two-channel bridge-tied load (BTL) Class-D amplifier output

Typische Anwendungen

  • High End Soundbar, Mini Combo Systems, Active Speakers and Subwoofers, Blu-Ray Disc™ / DVD Receivers, High End HTiB Systems , AV Receivers

Weiterführende Informationen

Artikeldaten

Artikel Nr.
Daten­blatt
Simu­lation
Downloads
Status
Produktserie
C
Tol. C
VR(V (DC))
Bauform
Betriebstemperatur
DF(%)
RISO
Keramiktyp
L(mm)
B(mm)
H(mm)
Fl(mm)
Verpackung
Muster
WCAP-CSGP MLCCs 25 V(DC), 10 µF, ±10%
Simu­lation
Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.
Kapazität10 µF
Kapazität±10% 
Nennspannung25 V (DC)
Bauform1206 
Betriebstemperatur -55 °C up to +125 °C
Verlustfaktor10 %
Isolationswiderstand0.01 GΩ
KeramiktypX7R Klasse II 
Länge3.2 mm
Breite1.6 mm
Höhe1.6 mm
Pad Dimension0.5 mm
Verpackung7" Tape & Reel