| Topologie | DAC |
The TI Analog Crossover Audio Plug-in Module (SIDEGIG-XOVEREVM) turns TI Audio Class-D amplifier EVM’s into a high quality, two-way speaker amplifier. The plug-in module makes it easy to remove thelarge and expensive passive crossover found in passive loudspeakers and create a bi-amped,two-way system with improved efficiency and reduced size. The board features a tunable active crossover with ahigh-pass filter,low-pass filter,baffle step, and delay to create two audio output signals for a tweeter and woofer. There are many advantages of designing active speakers including well-matched and well-tunedaudio. This audio plug-in module plugs into an analog input Class-D audio evaluation module (EVM) with an audio interface board (AIB) connector. This document provides information including setup,operation, schematics,bill of materials (BOM) and printed-circuit board (PCB) layout.
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR(V (DC)) | Bauform | Betriebstemperatur | DF(%) | RISO | Keramiktyp | L(mm) | B(mm) | H(mm) | Fl(mm) | Verpackung | Muster |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WCAP-CSGP MLCCs 25 V(DC), 10 µF, ±10% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 25 V(DC) | Kapazität10 µF | Kapazität±10% | Nennspannung25 V (DC) | Bauform1206 | Betriebstemperatur -55 °C up to +125 °C | Verlustfaktor10 % | Isolationswiderstand0.01 GΩ | KeramiktypX7R Klasse II | Länge3.2 mm | Breite1.6 mm | Höhe1.6 mm | Pad Dimension0.5 mm | Verpackung7" Tape & Reel |