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Details
| Topologie | USB |
| Eingangsspannung | 12 V |
| Ausgang 1 | 5 V |
Beschreibung
The EVB-USB7002 is a demonstration and evaluation platform that provides the necessary requirements and interface options for evaluating the USB7002, which is a 4-port High-Speed (HS) USB smart hub on a 4-layer RoHS-compliant Printed CircuitBoard (PCB). This allows the user to gain an understanding of the product and accelerate the integration of the USB7002 into the user’s design.
Eigenschaften
- Microchip’s PortSwap, PHYBoostTM, and VariSenseTM technologies
- USB7002 in a 100-pin QFN RoHS compliant package
- USB 3.1 compliant (Gen1 operation)
- USB 2.0 compliant (HS, FS, and LS operation)
- 5V-tolerant USB pins
- Self-powered operation
- USB Gen1 Type-C upstream port
- Four Downstream USB ports:
- Two Type-C Gen1 downstream ports
- Two Type-A USB 2.0-only downstream ports
- All downstream ports support individual port power and overcurrent sense.
- All downstream ports can be enabled for battery charging with the batterycharging select shunts J1 and J20. (BC1.2 or SE1, 2.1A max per port)
- Onboard SPI Flash for external downloadable firmware
- Operates from a single voltage (+12.0V, regulated) external power supply
- Onboard 25 MHz crystal or oscillator input
- Single onboard +5.2V, 15A regulator
- Single onboard +3.3V, 0.5A regulator
- Single onboard +1.2V, 2A regulator
- Port Power LED indicators
- SPI Flash activity blue LED indicator
- Reset red LED indicator
- Green LED indicators for 5V, 3.3V, and 1.2V regulator outputs
- Terminal block connector for use with an external 12 VDC bench supply
- Barrel connector for use with a Microchip 12V power supply
- Removable or non-removable downstream ports options can be configured withselect shunt on J17.
- Bridge peripheral functions:
- USB-to-UART (CDC)
- USB-to-I2S Audio Codec
- USB-to-SMBus
- USB-to-I2C
Typische Anwendungen
- Battery Chargers
Weiterführende Informationen
Artikeldaten
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR(V (DC)) | Bauform | Betriebstemperatur | DF(%) | RISO | Keramiktyp | L(mm) | B(mm) | H(mm) | Fl(mm) | Verpackung | L(µH) | IRP,40K(A) | ISAT,10%(A) | ISAT,30%(A) | RDC(mΩ) | fres(MHz) | Material | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WCAP-CSGP MLCCs 16 V(DC), 10 µF, ±20% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 16 V(DC) | Kapazität10 µF | Kapazität±20% | Nennspannung16 V (DC) | Bauform0805 | Betriebstemperatur -55 °C up to +85 °C | Verlustfaktor10 % | Isolationswiderstand0.01 GΩ | KeramiktypX5R Klasse II | Länge2 mm | Breite1.25 mm | Höhe1.25 mm | Pad Dimension0.5 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | |||||
 | WE-HCI SMT-Hochstrominduktivität, –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWE-HCI SMT-Hochstrominduktivität | – | – | – | Bauform1365 | Betriebstemperatur -40 °C up to +155 °C | – | – | – | Länge13.2 mm | Breite12.8 mm | Höhe6.2 mm | – | – | Induktivität2 µH | Performance Nennstrom26.5 A | Sättigungsstrom 19 A | Sättigungsstrom @ 30%22 A | Gleichstromwiderstand2.6 mΩ | Eigenresonanzfrequenz45 MHz | MaterialWE-PERM |