Infineon Technologies CYUSB3014 | Demoboard TIDA-010057

Beschreibung

Significant technological advancements and high degree of integration in Medical imaging, especially hand-held ultrasound smart probes, are pushing engineers to come up with highly-efficient, noise immune power solutions in a small size. This reference design documents end to end power and data solution for our high performance 128-channel Tx/64-channel Rx ultrasound smart probe solution with TX7332 transmit chip and AFE5832LP receive chip. The power tree includes a single-stage transformer-less HV generation (up to +/- 80V & height <5mm) for transmit and the point-of-load LV for the AFEs & FPGA from a 5V USB Type-C™ input. This design enables low-noise (<10mV ripple) efficient rails and better thermal performance (< 10°C temp rise) achieving system efficiency ~80%, receive data SNR > 55dB and ultra-compact size (90mm x 45mm x 20mm). All power rails can be synchronized to an external clock using our integrated buffer-divider CDCE949. This design also supports 1S battery input with a normal ultrasound operation of up to 2 hours.

Eigenschaften

• Transformer less dual rail HV (±80V @ 25 mA) generation from 5V USB in single stage implementation to meet component height requirement of < 5mm
• Low ripple and LV supply for the front end and FPGA from a 5V USB Type-C input
• Compact board size (< 90mm x 45 mm x 20mm)
• End to End System Efficiency ~80% running at full load
• SNR > 55dB (Noise Floor below -90dB)
• EN/DISABLE supplies for power optimization and all rails can be synchronized to external clock
• Accurate real time power consumption measurement using high performance instrumentation amplifiers INA231
• High speed data acquisition over USB Type C up to 4.2 Gbps

Typische Anwendungen

• Ultrasound smart probe

Weiterführende Informationen

• Datenblatt
• Produktseite des IC-Herstellers