IC-Hersteller Infineon Technologies
IC-Hersteller (96)
- Alle Hersteller
Analog Devices
Infineon Technologies
Maxim Integrated
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (12)
- Ablic (23)
- Advanced Power (4)
- Allegro Microsystems (83)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (130)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Broadcom (47)
- Cambridge GaN Devices (16)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Dialog Semiconductor (11)
- Diodes Incorporated (219)
- Divimath (8)
- Elmos AG (1)
- EPC (98)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (6)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- Ikanos (3)
- IKON (1)
- Indie Semiconductor (1)
- Innovision Semiconductor Inc (2)
- Intel (80)
- Inventchip Technology (3)
- ISSI (34)
- JoulWatt (20)
- KDPOF (2)
- Kinetic Technology (9)
- Lattice semiconductor Corporation (9)
- Littelfuse (1)
- M3 Technology (M3Tek) (4)
- Macnica (16)
- MaxLinear (175)
- MikroE (7)
- MindCet (1)
- Monolithic Power Systems (879)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (2)
- Nisshinbo Micro Device Inc. (10)
- Nordic Semiconductor (1)
- Novosense Micro (1)
- NXP (312)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (96)
- Pulsiv (18)
- Qorvo (87)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (289)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (90)
- SG-Micro (19)
- Silanna Semiconductor (8)
- Silergy Corporation (29)
- Silicon Laboratory Inc. (90)
- Silicontent Technology (56)
- Silvertel (54)
- Skyworks (31)
- Southchip (6)
- Summit Wireless (1)
- Tagore Tech (4)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (1)
- Valens Semiconductor (18)
- Wise Integration (1)
- Wolfspeed (5)
- Xilinx (18)
- XL Semiconductor (3)
- XYSemi (62)
Infineon Technologies 4DIR1400H | Demoboard EVAL_ISO_4DIR1400H
Evaluation board for Infineon ISOFACE™ quad-channel digital isolators
Details
| Topologie | Sonstige Topologie |
| IC-Revision | 1.0 |
Beschreibung
Isolation provides safety in HV applications and improves electrical noise immunity. To meet the continually growing requirements for isolation products, Infineon Technologies offers ISOFACE™ quad-channel digital isolators with the highest robustness, most accurate timing performance and lowest power consumption. This product family, based on coreless transformer (CT) technology, uses two coils stacked on top of each other with SiO2 as insulation material in between.
Eigenschaften
- RoHS-compliant PG-DSO-16 wide-body 300 mil package
- High common-mode transient immunity, greater than 100 kV/µs
- Wide supply voltage range, from 2.7 to 6.5 V (absolute maximum 7.5 V)
- Accurate timing, with 26 ns typical propagation delay and -6/+7 ns spread
- Lower power consumption with maximum 6.2 mA at 3.3 V and 1 Mbps
- CMOS variable input thresholds
- Pin-to-pin compatible with all quad-channel digital isolator products in SOIC-16 wide-body package(300 mil) available on the market
Typische Anwendungen
- AC-DC converter in telecom and server power supply systems, Isolated SPI communication
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Produktserie | Anwendung | PCB/Kabel/Panel | Modularity | Wire Section | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q (%) | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Leiterplattendicke (mm) | f | Mittelkontakt | Pins | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 691213510002 | SPEC | – | 6 Dateien | WR-TBL Serie 2135 - 5.08 mm Horizontal Entry Modular w. Rising Cage Clamp | Rising Cage Clamp | PCB | Ja | 14 to 30 (AWG) 2.08 to 0.0509 (mm²) | – | – | – | – | -30 °C up to +120 °C | – | – | – | – | 10.16 | – | – | – | – | – | 2 | – | – | – | Horizontal | 14 | Karton | |
 | 885012006052 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | 15 pF | ±5% | 50 | 0603 | -55 °C up to +125 °C | 700 | – | 10 GΩ | NP0 Klasse I | 1.6 | 0.8 | 0.4 | – | – | – | – | – | 0.8 | – | – | – | 7" Tape & Reel | ||
| 885012206076 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | 1 µF | ±10% | 25 | 0603 | -55 °C up to +125 °C | – | 10 | 0.5 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | – | – | – | – | – | 0.8 | – | – | – | 7" Tape & Reel | ||
| 885012206095 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | 100 nF | ±10% | 50 | 0603 | -55 °C up to +125 °C | – | 3 | 5 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | – | – | – | – | – | 0.8 | – | – | – | 7" Tape & Reel | ||
 | 61300311121 | SPEC | – | 6 Dateien | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | 7.62 | – | – | – | – | – | 3 | Single | – | Pin Header | Gerade | 3 | Beutel | |
 | 60312202114514 | SPEC | – | 7 Dateien | WR-SMA PCB End Launch | – | PCB | – | – | – | – | – | – | -65 °C up to +165 °C | – | – | 5000 MΩ | – | – | – | – | 1.6 | DC~18 GHz | Ø 0.51 WIDE x 0.25 THK | – | – | – | Jack | – | – | Tray | |
| 885012106031 | SPEC | 8 Dateien | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | 10 µF | ±20% | 25 | 0603 | -55 °C up to +85 °C | – | 20 | 0.01 GΩ | X5R Klasse II | 1.6 | 0.8 | 0.35 | – | – | – | – | – | 0.8 | – | – | – | 7" Tape & Reel |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 691213510002 | SPEC | – |
| 885012006052 | SPEC | |
| 885012206076 | SPEC | |
| 885012206095 | SPEC | |
| 61300311121 | SPEC | – |
| 60312202114514 | SPEC | – |
| 885012106031 | SPEC |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Produktserie | Anwendung | PCB/Kabel/Panel | Modularity | Wire Section | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q (%) | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Leiterplattendicke (mm) | f | Mittelkontakt | Pins | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster |
|---|