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Infineon Technologies 4DIR1400H | Demoboard EVAL_ISO_4DIR1400H
Evaluation board for Infineon ISOFACE™ quad-channel digital isolators
Details
| Topologie | Sonstige Topologie |
| IC-Revision | 1.0 |
Beschreibung
Isolation provides safety in HV applications and improves electrical noise immunity. To meet the continually growing requirements for isolation products, Infineon Technologies offers ISOFACE™ quad-channel digital isolators with the highest robustness, most accurate timing performance and lowest power consumption. This product family, based on coreless transformer (CT) technology, uses two coils stacked on top of each other with SiO2 as insulation material in between.
Eigenschaften
- RoHS-compliant PG-DSO-16 wide-body 300 mil package
- High common-mode transient immunity, greater than 100 kV/µs
- Wide supply voltage range, from 2.7 to 6.5 V (absolute maximum 7.5 V)
- Accurate timing, with 26 ns typical propagation delay and -6/+7 ns spread
- Lower power consumption with maximum 6.2 mA at 3.3 V and 1 Mbps
- CMOS variable input thresholds
- Pin-to-pin compatible with all quad-channel digital isolator products in SOIC-16 wide-body package(300 mil) available on the market
Typische Anwendungen
- AC-DC converter in telecom and server power supply systems, Isolated SPI communication
Weiterführende Informationen
Artikeldaten
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Pins | PCB/Kabel/Panel | Modularity | Typ | Wire Section | C | Tol. C | VR(V (DC)) | Bauform | Betriebstemperatur | Q(%) | DF(%) | RISO | Keramiktyp | L(mm) | B(mm) | H(mm) | Fl(mm) | Verpackung | Schutzart | Leiterplattendicke(mm) | f | Mittelkontakt | Montageart | IR(A) | Arbeitsspannung(V (AC)) | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | WR-TBL Serie 2135 - 5.08 mm Horizontal Entry Modular w. Rising Cage Clamp, 2, Käfigzugklemme | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | Pins2 | PCB/Kabel/PanelPCB | ModularityJa | TypHorizontal | Wire Section 14 to 30 (AWG) 2.08 to 0.0509 (mm²) | – | – | – | – | Betriebstemperatur -30 °C up to +120 °C | – | – | – | – | Länge10.16 mm | – | – | – | VerpackungKarton | – | – | – | – | MontageartTHT | Nennstrom14 A | Arbeitsspannung250 V (AC) | ||||
 | WR-PHD Stiftleisten - Einreihig, 3, – | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWR-PHD Stiftleisten - Einreihig | Pins3 | – | – | TypGerade | – | – | – | – | – | Betriebstemperatur -40 °C up to +105 °C | – | – | Isolationswiderstand1000 MΩ | – | Länge7.62 mm | – | – | – | VerpackungBeutel | – | – | – | – | MontageartTHT | Nennstrom3 A | Arbeitsspannung250 V (AC) | |||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | Kapazität15 pF | Kapazität±5% | Nennspannung50 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | Güte700 % | – | Isolationswiderstand10 GΩ | KeramiktypNP0 Klasse I | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 25 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | Kapazität1 µF | Kapazität±10% | Nennspannung25 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor10 % | Isolationswiderstand0.5 GΩ | KeramiktypX7R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 50 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | Kapazität100 nF | Kapazität±10% | Nennspannung50 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +125 °C | – | Verlustfaktor3 % | Isolationswiderstand5 GΩ | KeramiktypX7R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – | |||||
 | WR-SMA PCB End Launch, –, – | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWR-SMA PCB End Launch | – | PCB/Kabel/PanelPCB | – | – | – | – | – | – | – | Betriebstemperatur -65 °C up to +165 °C | – | – | Isolationswiderstand5000 MΩ | – | – | – | – | – | VerpackungTray | SchutzartNone | Leiterplattendicke1.6 mm | FrequenzbereichDC~18 GHz | MittelkontaktØ 0.51 WIDE x 0.25 THK | MontageartEnd Launch | – | Arbeitsspannung335 V (AC) | |||
| WCAP-CSGP MLCCs 25 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | Kapazität10 µF | Kapazität±20% | Nennspannung25 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +85 °C | – | Verlustfaktor20 % | Isolationswiderstand0.01 GΩ | KeramiktypX5R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.35 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | – |