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Details
| Topologie | Sonstige Topologie |
| IC-Revision | 1 |
Beschreibung
The ARD_X_VRX_A1 and ARD_X_VRX_A2 are scalable power supplies designed to provide power to Xilinx Virtex UltraScale+ FPGA devices. The designs are scalable to support the Full Power Management FPGA devices.
Eigenschaften
- AmP PMIC enables programmable custom PMIC
- Integrate application targeted Power Components
- Power Blocks for a variety of topologies
- Scalable Integrated N-channel MOSFETs (SIM)
- Voltage, current sense for protection, telemetry, regulation
- Build Switching topologies - High/Low current buck, single/two phase DrMOS control
- Build Linear topologies - LDO, Load Switch
- Analog fabric connectivity for sensor signals
- Digital μLogic fabric connectivity: Analog/Digital Blocks
- Industry first: Analog Proficiency - Digital Flexibility
Typische Anwendungen
- Power Component Integrator, Digital power management IC
Weiterführende Informationen
Artikeldaten
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR(V (DC)) | Bauform | Betriebstemperatur | DF(%) | RISO | Keramiktyp | L(mm) | B(mm) | H(mm) | Fl(mm) | Verpackung | Muster |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WCAP-CSGP MLCCs 25 V(DC), 100 nF, ±10% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 25 V(DC) | Kapazität100 nF | Kapazität±10% | Nennspannung25 V (DC) | Bauform0201 | Betriebstemperatur -55 °C up to +85 °C | Verlustfaktor10 % | Isolationswiderstand0.5 GΩ | KeramiktypX5R Klasse II | Länge0.6 mm | Breite0.3 mm | Höhe0.3 mm | Pad Dimension0.15 mm | Verpackung7" Tape & Reel | ||||
| WCAP-CSGP MLCCs 25 V(DC), 1 µF, ±20% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 25 V(DC) | Kapazität1 µF | Kapazität±20% | Nennspannung25 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +85 °C | Verlustfaktor10 % | Isolationswiderstand0.5 GΩ | KeramiktypX5R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.4 mm | Verpackung7" Tape & Reel | ||||
| WCAP-CSGP MLCCs 25 V(DC), 10 µF, ±20% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 25 V(DC) | Kapazität10 µF | Kapazität±20% | Nennspannung25 V (DC) | Bauform0603 | Betriebstemperatur -55 °C up to +85 °C | Verlustfaktor20 % | Isolationswiderstand0.01 GΩ | KeramiktypX5R Klasse II | Länge1.6 mm | Breite0.8 mm | Höhe0.8 mm | Pad Dimension0.35 mm | Verpackung7" Tape & Reel | ||||
| WCAP-CSGP MLCCs 6.3 V(DC), 47 µF, ±20% | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 6.3 V(DC) | Kapazität47 µF | Kapazität±20% | Nennspannung6.3 V (DC) | Bauform0805 | Betriebstemperatur -55 °C up to +85 °C | Verlustfaktor10 % | Isolationswiderstand0.002 GΩ | KeramiktypX5R Klasse II | Länge2 mm | Breite1.25 mm | Höhe1.25 mm | Pad Dimension0.5 mm | Verpackung7" Tape & Reel |